Abstract: A method for managing design files shared by multiple users is provided. A plurality of design files are stored in a design library. A lock table is moved to a memory of a first computer when information of the lock table indicates that the design files were locked by a first process corresponding to a first user, wherein the memory is only accessible to performance of the first process. The lock table is moved from the memory to a common memory of the first computer when one design file is locked by a second process corresponding to a second user. The first and second processes are being performed in the first computer. The lock table is moved from the memory to the design library when the one design file is locked by the second process corresponding to the second user, wherein the second process is performed in a second computer.

Abstract: In various embodiments, each possible different instance of a repeated block can be concurrently modified for chip routing. Repeated blocks can be implemented where all instances of a repeated block are identical or substantially identical. Pin placement may be determined based on analysis of the I/O for all instances. The pin placement may be generated to be identical or substantially similar for all instances. Flyover blockages can be designed into repeated blocks to enable the global router to wire through the repeated block. Buffers and associated pins can be inserted into repeated block within the flyover space where the global router wires to the needed buffer through area pins.

Abstract: A method for recursive hierarchical static timing analysis. The method includes accessing a lower-level netlist representing a lower-level block of a circuit design to be realized in physical form, and accessing constraints for the lower-level block. Static timing analysis is performed on the lower-level block. The method includes accessing an upper-level netlist representing an upper-level block of the circuit design to be realized in physical form, and accessing constraints for the upper-level block. Static timing analysis is performed on the upper-level block while incorporating results from the static timing analysis on the lower-level block.

Abstract: A simulation environment, in one embodiment, includes a debugger server, one or more debuggers, and one or more debugger adapters. Each debugger adapter couples a corresponding debugger to the debugger server. The debugger server coordinates the run mode of the debugger adapters. Each debugger adapter controls the run mode of its corresponding debugger.

Abstract: Various methods and apparatuses are described for a power distribution structure. In an embodiment, an integrated circuit contains power gating cells that each contain Metal Oxide Semiconductor (MOS) device switches located relative in the power distribution structure to power up and down a block of logic containing a plurality of individual cells using these MOS device switches. The MOS device switches can be tuned to requirements of a target block of logic in order to meet its optimal voltage drop requirements during its active operational state while minimizing leakage current in its off state.

Abstract: A connection scheme is used to selectively connect a dither capacitor included in a calibrated stage of a pipeline analog-to-digital converter (ADC) in a way that reduces the output voltage swing of the stage. A first terminal of the dither capacitor is coupled to an input of the amplifier. A second terminal of the dither capacitor is coupled to either a first or second reference voltage dependent on a bit value in a Pseudo-Random Binary Sequence (PRBS) if a voltage received by the stage is within a first voltage range. If the stage received voltage is within a second range, the second terminal is coupled to the first reference voltage independent of the PRBS. If the stage received voltage is within a third range, the second terminal is coupled to the second reference voltage independent of the PRBS.

Abstract: Simulation control techniques include shutting down peer processes and user code modules, storing an image of a simulation as a checkpoint after the peer processes and user code modules are shutdown, and re-starting user code modules and peer processes after storing an image of the simulation. The resulting checkpoint and processes can be used for restoring from a checkpoint or restarting a new simulation environments having peer processes such as debuggers coupled to the simulation.

Abstract: A switching scheme is used during a calibration mode for determining calibration coefficients of each calibrated stage of a pipeline analog-to-digital converter (ADC). A calibrated stage of the pipeline ADC includes an amplifier for amplifying a residue voltage of the stage and a sampling capacitor comprising a plurality of sub-capacitors. The plurality of sub-capacitors have a first terminal connected to an input of amplifier and a second terminal connected to one or more switches that selectively couple the second terminal to the input terminal of the stage, a first reference voltage or a second reference voltage lower than the first reference voltage. During foreground calibration, a number of measurements are taken at an output of the amplifier to determine the calibration coefficient of the calibrated stage.

Abstract: An integrated circuit design optimization procedure to modify a cell feature, such as gate length, models changes in delay as a result of the modification. In the delay change calculation, a characteristic of an event in cell switching behavior, such as the output short-circuit voltage VSC, is determined for the modified cell, where changes in the determined characteristic correlate with changes in delay of the cell due to the modification. Next, a value for delay of the modified cell is determined as a function of the determined characteristic of the event. The procedure can be applied after placement and routing. A timing-constrained, leakage power reduction is described using the delay change model.

Abstract: A multiple mask and a multiple masking layer technique can be used to pattern an IC layer. A RET can be used to define one or more fine-line patterns in a first masking layer. Portions of the fine-line features are then removed or designated for removal using a mask. This removal/designation can include accessing a desired layout (with at least one layout feature including a fine-line feature and a coarse feature) and expanding layout features only in directions along critical dimensions of those layout features. Another mask can then be used to define coarse features in a second masking layer formed over the patterned first masking layer. Coarse feature(s) can be derived from the desired layout using a shrink/grow operation performed only in directions orthogonal to a critical dimension of the fine-line features. The IC layer can be patterned using the composite mask formed by the patterned first and second masking layers.

Abstract: Switch circuits are disclosed, for providing a single-ended and a differentially switched high-voltage output signals by switching a high supply voltage in response to at least one logic-level control signal. The switch that provides the single-ended switched high-voltage output signal includes a chain of at least three serially coupled field effect transistors (FETs). The chain receives the high supply voltage and switches it to output the high-voltage output signal. The switch that provides the differentially switched high-voltage output signal includes two differentially coupled chains, each having at least three serially coupled FETs. The chains receive the high supply voltage and switch it to output the differential high-voltage output signal. A control/bias circuit provides a control voltage to at least one of the FETs in the chains, responsive to the control signal.

Abstract: Circuit simulation can be performed on digital, analog, and mixed signal types of circuitry. Phases of operation are identified for a circuit and transient behavior is analyzed. Multiple time points are identified and the circuit is replicated for those time points with evaluation of the circuitry performed at those various time points. Simultaneous optimization is performed across the time points. Transistors and other devices can have their lengths, widths, and number of fingers optimized. Simulation can include determining Kirchhoff current law equations for various nodes within the circuit. Equations describing device operation can include non-convex signomial equations and convex polynomial equations.

Abstract: A method of managing the configuration, design parameters, and functionality of an integrated circuit (IC) design using a hardware description language (HDL). Instructions can be added, subtracted, or generated by the designer interactively during the design process, and customized HDL descriptions of the IC design are generated through the use of scripts based on the user-edited instruction set and inputs. The customized HDL description can then be used as the basis for generating “makefiles” for purposes of simulation and/or logic level synthesis. The method further affords the ability to generate an HDL model of a complete device, such as a microprocessor or DSP. A computer program implementing the aforementioned method and a hardware system for running the computer program are also disclosed.

Abstract: Techniques and systems for optimizing a circuit design are described. In some embodiments, a sequential cell is selected for optimization. Next, the system iterates through a set of candidate sequential cells that are functionally equivalent to the sequential cell that is being optimized. The system evaluates the global timing impact of each candidate sequential cell in a highly efficient manner. For each candidate sequential cell that is evaluated, a non-timing metric and a timing metric for a candidate sequential cell are compared with the corresponding non-timing metric and timing metric for the current best sequential cell. If a candidate sequential cell improves the timing metric, or maintains the timing metric and has better non-timing metric(s), then the candidate sequential cell is stored as the current best sequential cell. Once the process completes, the current best sequential cell is the optimized cell size for the sequential cell.

Abstract: Techniques and systems are described for improving the efficiency of timing calculations in numerical sequential cell sizing and for improving the efficiency of incremental slack margin propagation. Some embodiments cache timing-related information associated with a source driver that drives an input of a sequential cell that is being sized, and/or timing-related information for each output of the sequential cell that is being sized. The cached timing-related information for the source driver can be reused when sizing a different sequential cell. The cached timing-related information for the outputs of the sequential cell can be reused when evaluating alternatives for replacing the sequential cell. Some embodiments incrementally propagate slack margins in a lazy fashion (i.e., only when it is necessary to do so for correctness or accuracy reasons) while sizing gates in the circuit design in a reverse-levelized processing order.

Abstract: Systems and techniques are described for determining a transition-effect model for a timing arc of a library cell. A transition-effect model can be determined for each library cell that is used during an optimization process. The transition-effect models enable an optimization system to estimate the impact of a change in the transition at an output of a driver gate on the delays of downstream gates without requiring to propagate the change in the transition to the downstream gates. Once determined, the transition-effect models can be used to compute one or more transition-induced penalties during circuit optimization. An optimization system can then use the one or more transition-induced penalties to determine whether or not to accept an optimizing transformation, or to discretize a solution obtained from a numerical solver.

Abstract: Non-volatile memory (NVM) devices are disclosed. In one aspect, a NVM device may include a substrate, and a field-effect transistor (FET). The FET may include a first doped region in the substrate and a second doped region in the substrate. The first and the second doped regions may define a channel region of the substrate between them. An insulating layer may overlie the channel region. A floating gate may overlie the insulating layer. Charge of an amount that encodes a value may be stored on the floating gate. The floating gate and the first and the second doped regions may be shaped such that the floating gate defines with the first doped region a first border of a first length, and the floating gate defines with the second doped region a second border of a second length that is less than 90% of the first length.

Abstract: One embodiment of the present invention provides techniques and systems for modeling mask errors based on aerial image sensitivity. During operation, the system can receive an uncalibrated process model which includes a mask error modeling term which is based at least on an aerial image sensitivity to mask modifications which represent mask errors. Next, the system can fit the uncalibrated process model using measured CD data. Note that the mask error modeling term can also be dependent on the local and/or long-range pattern density. In some embodiments, the mask error modeling term can include an edge bias term and a corner rounding term. The edge bias term can be based on the sensitivity of the aerial image intensity to an edge bias, and the corner rounding term can be based on the sensitivity of the aerial image intensity to a corner rounding adjustment.

Abstract: An electronic device is provided which comprises a plurality of processing units (IP1-IP6), a network-based interconnect (N) coupled to the processing units (IP1-IP6) and at least one monitoring unit (P1, P2) for monitoring a data flow of at least one first communication path between the processing units (IP1-IP6) and for forwarding monitoring results at least temporarily via at least two separate communication paths (MC1, MC2).

Abstract: Parasitic extraction is a useful tool for analyzing and improving timing and other characteristics of semiconductor chips. Parasitic resistance and capacitance values are determined and stored in arrays. The parasitic values are extracted for multiple corners with a single analysis of the layout. Multi-corner analysis is performed using the parasitic values thereby optimizing the timing across various temperature and process operating points.