Patents by Inventor Synu-ichi Chiba

Synu-ichi Chiba has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper alloy lead frame material for semiconductor devices
    Patent number: 4877577
    Abstract: A copper alloy material for lead frames for semiconductor devices. The lead frame material consists essentially of:Ni: 0.5-2 percent by weight;Sn: 1.2-2.5 percent by weight;Si: 0.05-0.5 percent by weight;Zn: 0.1-1 percent by weight;Ca: 0.001-0.01 percent by weight;Mg: 0.001-0.05 percent by weight;Pb: 0.001-0.01 percent by weight; andCu and inevitable impurities: the balance.The lead frame material obtained possesses not only high strength, but also excellent thermal-exfoliation resistance of the solder, and also enhances the wear resistance of the stamping dies, while possessing excellent other properties, such as repeated-bending strength, thermal conductivity and electrical conductivity, platability, and solderability, which are required of lead frames.
    Type: Grant
    Filed: October 12, 1988
    Date of Patent: October 31, 1989
    Assignee: Mitsubishi Shindoh Co., Ltd.
    Inventors: Rensei Futatsuka, Synu-ichi Chiba, Tadao Sakakibara