Patents by Inventor SYNZTEC CO., LTD.

SYNZTEC CO., LTD. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20130224514
    Abstract: The present invention provides a fixation member having a multi-layer metallic structure, which member comprises a substrate employing electroformed nickel for preventing image quality failure. The fixation member of the present invention includes a metallic substrate including a first layer formed of an electroformed seamless belt made of nickel or a nickel alloy, and a second layer formed of an electroformed seamless belt made of a metal having a thermal conductivity greater than that of the first layer; an adhesion layer disposed on the surface of the second layer; and a fluororesin layer disposed by the mediation of the adhesion layer, wherein the ratio of the thickness of the second layer to the total thickness of the metallic substrate is 0.66 to 0.95.
    Type: Application
    Filed: February 21, 2013
    Publication date: August 29, 2013
    Applicants: SYNZTEC CO., LTD., NOK CORPORATION
    Inventors: NOK CORPORATION, SYNZTEC CO., LTD.