Abstract: A surface plasmon sensor includes a light guide reflection plate, a surface plasmon resonance layer formed on a first surface of the light guide reflection plate, a light emitting unit having a light source disposed on an end surface of the light guide reflection plate, and a light receiving element. The surface plasmon resonance layer includes a metal layer. The light guide reflection plate includes at least one first reflection surface inclined against the first surface. The light guide reflection plate is configured to transmit light emitted by the light source. The at least one first reflection surface is configured reflect the light to the surface plasmon resonance layer. The metal layer is configured to reflect the light reflected by the at least one first reflection surface. The light receiving element is configured to receive the light reflected by the metal layer.

Abstract: A surface plasmon sensor includes a light guide reflection plate, a surface plasmon resonance layer formed on a first surface of the light guide reflection plate, a light emitting unit having a light source disposed on an end surface of the light guide reflection plate, and a light receiving element. The surface plasmon resonance layer includes a metal layer. The light guide reflection plate includes at least one first reflection surface inclined against the first surface. The light guide reflection plate is configured to transmit light emitted by the light source. The at least one first reflection surface is configured reflect the light to the surface plasmon resonance layer. The metal layer is configured to reflect the light reflected by the at least one first reflection surface. The light receiving element is configured to receive the light reflected by the metal layer.

Abstract: In a flow sensor, a heater is provided in the middle of an insulation thin film stretched above a gap on a substrate. Temperature measuring elements, which in some embodiments are thermopiles, are provided on both sides of the same, and an ambient temperature measuring resistive element is provided on the top surface of the silicon substrate. The thermopiles in some embodiments are made of polysilicon and aluminum, and in some embodiments the polysilicon is doped with phosphorus (P). In some embodiments, the amount of phosphorus is determined such that temperature characteristics of the thermopiles and have an absolute value substantially equal to that of temperature characteristics attributable to factors other than the thermopiles and have a (positive or negative) sign opposite to that of the latter. Thus, the temperature characteristics of the thermopiles cancel the temperature characteristics attributable to factors other than the thermopiles.

Abstract: A pressure sensor 10 has a sensor chip 14 attached in a package 13 formed with a stem 11 and a cap 12 bonded at open surface sides thereof. On both sides of a diaphragm 14a of the sensor chip, pressures are applied via a measurement pressure introducing tube 11a formed in the stem and a reference pressure introducing tube 12a formed in the cap. Here, a filter 15 is arranged in the reference pressure introducing tube and response to pressure at the reference pressure side is made slow. When the sensor is arranged in a room with a door and a pressure in the room is applied via two introducing tubes, if there is an abrupt change caused by the opening/closing of the door, the pressure change is immediately introduced only at the side of measurement pressure introducing tube with fast response and the differential pressure corresponding to the pressure change is applied on the diaphragm. As the differential pressure is employed, it can be determined whether the door is opened or closed.

Abstract: A pressure sensor 10 has a sensor chip 14 attached in a package 13 formed with a stem 11 and a cap 12 bonded at open surface sides thereof On both sides of a diaphragm 14a of the sensor chip, pressures are applied via a measurement pressure introducing tube 11a formed in the stem and a reference pressure introducing tube 12a formed in the cap. Here, a filter 15 is arranged in the reference pressure introducing tube and response to pressure at the reference pressure side is made slow. When the sensor is arranged in a room with a door and a pressure in the room is applied via two introducing tubes, if there is an abrupt change caused by the opening/closing of the door, the pressure change is immediately introduced only at the side of measurement pressure introducing tube with fast response and the differential pressure corresponding to the pressure change is applied on the diaphragm. As the differential pressure is employed, it can be determined whether the door is opened or closed.

Abstract: In a flow sensor, a heater is provided in the middle of an insulation thin film stretched above a gap on a substrate. Temperature measuring elements, which in some embodiments are thermopiles, are provided on both sides of the same, and an ambient temperature measuring resistive element is provided on the top surface of the silicon substrate. The thermopiles in some embodiments are made of polysilicon and aluminum, and in some embodiments the polysilicon is doped with phosphorus (P). In some embodiments, the amount of phosphorus is determined such that temperature characteristics of the thermopiles and have an absolute value substantially equal to that of temperature characteristics attributable to factors other than the thermopiles and have a (positive or negative) sign opposite to that of the latter. Thus, the temperature characteristics of the thermopiles cancel the temperature characteristics attributable to factors other than the thermopiles.