Patents by Inventor Syohei Morimoto

Syohei Morimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board
    Patent number: 7709750
    Abstract: The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.
    Type: Grant
    Filed: May 10, 2006
    Date of Patent: May 4, 2010
    Assignees: Tatsuta System Electronics Co, Ltd., Nippon Mektron, Ltd.
    Inventors: Kazuhiro Hashimoto, Syohei Morimoto, Yoshinori Kawakami, Kenji Kamino, Satoshi Ebihara, Hideaki Tanaka, Takahisa Akatsuka
  • SHIELDING FILM, SHIELDED PRINTED CIRCUIT BOARD, SHIELDED FLEXIBLE PRINTED CIRCUIT BOARD, METHOD OF MANUFACTURING SHIELDING FILM, AND METHOD OF MANUFACTURING SHIELDED PRINTED CIRCUIT BOARD
    Publication number: 20090038839
    Abstract: The invention includes a shielding film, which does not have breakage of a metal layer, and has excellent abrasion resistance and blocking resistance, and does not crack. The cover film 7 is provided on one surface of a separation film 6a, and an adhesive layer 8a is formed on the surface of the cover film 7 opposite to the separation film 6a via the metal layer. The cover film 7 has at least one hard layer 7a and at least one soft layer 7b, and the surface of the cover film 7 facing the separation film 6a is composed of the hard layer 7a.
    Type: Application
    Filed: May 10, 2006
    Publication date: February 12, 2009
    Applicants: TATSUTA SYSTEM ELECTRONICS Co., LTD, NIPPON MEKTRON, LTD
    Inventors: Kazuhiro Hashimoto, Syohei Morimoto, Yoshinori Kawakami, Kenji Kamino, Satoshi Ebihara, Hideaki Tanaka, Takahisa Akatsuka