Patents by Inventor Syoichi Kimura

Syoichi Kimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5645787
    Abstract: A resin tablet for sealing by transfer molding a semiconductor, which is obtained by cooling and solidifying a molten resin composition, is disclosed. The tablet has a compressibility of not less than 98% and a metallic impurity content of less than 50 ppm, preferably with the amount of fine powders of 250 mesh or smaller adhered thereto being controlled below 0.05% by weight based on the tablet and a water content being controlled below 0.1% by weight.
    Type: Grant
    Filed: June 5, 1995
    Date of Patent: July 8, 1997
    Assignee: Nitto Denko Corporation
    Inventors: Tomohiro Taruno, Shinichi Kanai, Hiroyuki Asao, Syoichi Kimura, Yoshio Toyoda