Patents by Inventor Syoji Nakakuki

Syoji Nakakuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method and apparatus for separating semiconductor chips
    Publication number: 20040083602
    Abstract: In an apparatus for separating semiconductor chips, a semiconductor wafer stuck to an adhesive sheet with its silicon mirror surface facing downwards is sucked as a whole through its circuit surface side by means of a sucker plate capable of sucking the whole of wafer. In order to separate the sheet from a frame fixing the sheet while the sheet being sucked, the sheet is cut by a cutter edge so as to be separated from the frame. To separate the sheet from the wafer, the wafer top surface is guided by a guide plate having a tip angle of 15° and by causing the sheet to profile the tip of the guide plate, the sheet is peeled off in a direction making an angle of 45° to the dicing direction on the wafer.
    Type: Application
    Filed: June 23, 2003
    Publication date: May 6, 2004
    Inventors: Makoto Matsuoka, Hitoshi Odashima, Kazuyki Futagi, Syoji Nakakuki
  • Method and apparatus for separating semiconductor chips
    Patent number: 6602736
    Abstract: In an apparatus for separating semiconductor chips, a semiconductor wafer stuck to an adhesive sheet with its silicon mirror surface facing downwards is sucked as a whole through its circuit surface side by means of a sucker plate capable of sucking the whole of wafer. In order to separate the sheet from a frame fixing the sheet while the sheet being sucked, the sheet is cut by a cutter edge so as to be separated from the frame. To separate the sheet from the wafer, the wafer top surface is guided by a guide plate having a tip angle of 15° and by causing the sheet to profile the tip of the guide plate, the sheet is peeled off in a direction making an angle of 45° to the dicing direction on the wafer.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: August 5, 2003
    Assignee: Hitachi, Ltd.
    Inventors: Makoto Matsuoka, Hitoshi Odashima, Kazuyuki Futagi, Syoji Nakakuki