Patents by Inventor Syoji Nogami

Syoji Nogami has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing a semiconductor device with improved uniformity of buried conductor in contact holes
    Patent number: 5763324
    Abstract: The uniformity in buried condition of conductors in contact holes is enhanced over the entire wafer surface. A first resist is coated on a conductor provided selectively in a contact hole formed in an insulating film provided on a semiconductor substrate, as well as on the insulating film, and a resultant structure is flattened. The first resist and the conductor are removed with their portions being left. A second resist is coated on the conductor and insulating film and a resultant structure is flattened. The second resist and the conductor are removed until the insulating film is exposed.
    Type: Grant
    Filed: August 29, 1996
    Date of Patent: June 9, 1998
    Assignee: Kabushiki Kaisha Toshiba
    Inventor: Syoji Nogami