Patents by Inventor Syoji OCHIAI

Syoji OCHIAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • COOLING SYSTEM AND ELECTRONIC DEVICE
    Publication number: 20240090166
    Abstract: A cooling system includes a cooling member including a flow path of a cooling medium configured to cool a heat generating member, a supply side joint provided at a supply side tube and connected to one end of the flow path, a discharge side joint provided at a discharge side tube and connected to another end of the flow path, connection portions respectively provided in the supply side joint and the discharge side joint and connected to the cooling member, connected portions which are respectively formed at both end portions of the flow path and to which the connection portions are connected, and rotation prevention portions configured to prevent the connection portions and the connected portions from rotating relative to each other.
    Type: Application
    Filed: October 30, 2020
    Publication date: March 14, 2024
    Applicant: NEC Platforms, Ltd.
    Inventor: Syoji OCHIAI
  • Module including fixation portion provided at position at which stress from connection pipe to cooling unit is reduced and server including the same
    Patent number: 11284536
    Abstract: A module including a cooling unit that cools a heat-generating component provided on a substrate; a connection pipe that is connected to the cooling unit; and a fixation portion that is provided at a position at which stress from the connection pipe to the cooling unit is reduced, and that fixes the connection pipe.
    Type: Grant
    Filed: July 25, 2018
    Date of Patent: March 22, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Syoji Ochiai
  • Module, and server
    Patent number: 11246242
    Abstract: A module including a substrate; a cooling unit that cools a heat-generating component provided on the substrate; a connection terminal portion provided on the substrate; and a connection pipe that is connected to the cooling unit and that extends in a direction different from a direction of at least one of insertion and withdrawal of the connection terminal portion, wherein the connection pipe extends from a side towards the connection terminal portion.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: February 8, 2022
    Assignee: NEC Platforms, Ltd.
    Inventor: Syoji Ochiai
  • MODULE, AND SERVER
    Publication number: 20210195805
    Abstract: A module including a substrate; a cooling unit that cools a heat-generating component provided on the substrate; a connection terminal portion provided on the substrate; and a connection pipe that is connected to the cooling unit and that extends in a direction different from a direction of at least one of insertion and withdrawal of the connection terminal portion, wherein the connection pipe extends from a side towards the connection terminal portion.
    Type: Application
    Filed: July 24, 2018
    Publication date: June 24, 2021
    Applicant: NEC Platforms, Ltd.
    Inventor: Syoji OCHIAI
  • MODULE, AND SERVER
    Publication number: 20210195795
    Abstract: A module including a cooling unit that cools a heat-generating component provided on a substrate; a connection pipe that is connected to the cooling unit; and a fixation portion that is provided at a position at which stress from the connection pipe to the cooling unit is reduced, and that fixes the connection pipe.
    Type: Application
    Filed: July 25, 2018
    Publication date: June 24, 2021
    Applicant: NEC Platforms, Ltd.
    Inventor: Syoji OCHIAI