Patents by Inventor Syoji Oikawa

Syoji Oikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4051001
    Abstract: After copper of printed circuit board lined with copper foil is etched with an acidic etching solution containing chloride ions, the resulting etching solution containing copper ions is placed in a cathode compartment partitioned with a diaphram from an anode compartment, while placing a caustic soda solution in the anode compartment, and subjected to electrolysis. In the cathode compartment, copper is deposited on an electrode without any redissolution of the deposited copper, and recovered, whereas in the anode compartment chlorine formed on an anode is absorbed into the caustic soda solution without any discharge to the atmosphere. The etching solution thus freed from the copper ions is admixed with the same kind of chemicals as consumed by the etching, and used again as a regenerated etching solution.
    Type: Grant
    Filed: August 22, 1975
    Date of Patent: September 27, 1977
    Assignee: Hitachi, Ltd.
    Inventors: Hajime Inoue, Fumio Harada, Kazunobu Kato, Syoji Oikawa