Patents by Inventor Syoji Ubukata

Syoji Ubukata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9809735
    Abstract: The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: November 7, 2017
    Assignee: Kaneka Corporation
    Inventors: Shusuke Yoshihara, Syoji Ubukata, Kazuaki Matsumoto
  • Publication number: 20160304762
    Abstract: The present invention relates to: (i) a resin composition having excellent thermal conductivity and capable of being processed into a thin-walled and flexible molded article, the resin composition containing: (a) a resin consisting of 40 to 60 mol % of a unit (A) having a biphenyl group, and 5 to 40 mol % of a linear unit (B), and 5 to 40 mol % of a linear unit (C), where a thermal conductivity of the resin itself is not less than 0.4 W/(m·K); and (b) an inorganic filler having thermal conductivity of not less than 1 W/(m·K), (ii) a heat-dissipating or heat-transferring resin material containing the resin composition, and (iii) a thermally conductive membrane containing the resin composition.
    Type: Application
    Filed: November 13, 2014
    Publication date: October 20, 2016
    Applicant: Kaneka Corporation
    Inventors: Shusuke Yoshihara, Syoji Ubukata, Kazuaki Matsumoto
  • Publication number: 20130202882
    Abstract: The present invention provides a highly thermally conductive resin molded article that satisfies all demands of a high thermal conductivity, an insulation property, a low density, a mechanical strength, a high flowability of a thin-walled molded article, less abrasion on a die used for manufacturing, and high whiteness. The highly thermally conductive resin molded article at least includes (A) thermoplastic polyester resin, (B) platy talc particles, and (C) a fiber reinforcement, and (B) platy talc particle content falls within a range between 10% by volume and 60% by volume, where the entire composition is 100% by volume, a number average particle size of the platy talc particles falls within a range between 20 ?m and 80 ?m, and the (B) platy talc particles are oriented in a surface direction of the highly thermally conductive resin molded article.
    Type: Application
    Filed: October 11, 2011
    Publication date: August 8, 2013
    Applicant: KANEKA CORPORATION
    Inventors: Soichi Uchida, Kazuaki Matsumoto, Masashi Sakaguchi, Yasushi Noda, Syoji Ubukata