Patents by Inventor Syoosaku Ishihara

Syoosaku Ishihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4464420
    Abstract: A ceramic multilayer circuit board is provided by sintering a multilayer wiring substrate containing alumina as a main component, which was prepared by the green sheet process, nickel plating and gold plating in this order on the superficial wiring conductor layer, printing a thick film conductor paste on the gold plating layer, firing the printed substrate and finally printing a thick film resistor paste on at least part of the thick film conductor layer and firing to form a thick film resistor layer.
    Type: Grant
    Filed: September 23, 1982
    Date of Patent: August 7, 1984
    Assignee: Hitachi, Ltd.
    Inventors: Noriyuki Taguchi, Tsuyoshi Fuzita, Gyozo Toda, Syoosaku Ishihara, Takashi Kuroki, Tatsuhiro Suzuki