Patents by Inventor Syougo Asai

Syougo Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9181464
    Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.
    Type: Grant
    Filed: January 18, 2010
    Date of Patent: November 10, 2015
    Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
    Inventors: Shingo Kaimori, Jun Sugawara, Akira Mizoguchi, Syougo Asai, Takuma Yoshisaka, Naota Uenishi
  • Publication number: 20120048598
    Abstract: Provided is an adhesive resin composition containing an epoxy resin and/or a phenoxy resin; an epoxy-containing copolymer obtained by copolymerizing a monomer having an epoxy group and an ethylenically unsaturated monomer that is copolymerizable with the monomer having an epoxy group; a thermoplastic resin; and a curing agent, wherein a copolymer having a weight-average molecular weight of 5,000 to less than 100,000 and a weight per epoxy equivalent of 3,500 g/eq or less is used as the epoxy-containing copolymer. The adhesive resin composition is capable of providing a one-part type adhesive solution that has a good compatibility of the polymer components, that has good flame retardancy and is halogen-free, and that has good storage stability. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.
    Type: Application
    Filed: March 26, 2010
    Publication date: March 1, 2012
    Inventors: Shingo Kaimori, Jun Sugawara, Akira Mizoguchi, Syougo Asai, Takuma Yoshisaka, Naota Uenishi
  • Publication number: 20110305883
    Abstract: Provided are an adhesive resin composition that is halogen-free, has good adhesiveness, solder heat resistance, and flame retardancy, and has good flow characteristics, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains a phosphorus-containing epoxy resin and/or a phosphorus-containing phenoxy resin, a phosphorus-containing polyester resin having a weight-average molecular weight of more than 20,000 and 150,000 or less, another thermoplastic resin, and a curing agent. The adhesive resin composition preferably further contains a benzoxazine compound. Preferably, substantially no inorganic filler is mixed in the adhesive resin composition.
    Type: Application
    Filed: January 18, 2010
    Publication date: December 15, 2011
    Applicants: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shingo Kaimori, Jun Sugawara, Akira Mizoguchi, Syougo Asai, Takuma Yoshisaka, Naota Uenishi
  • Publication number: 20110303439
    Abstract: Provided are an adhesive composition that is halogen-free and that can satisfy flame retardancy without impairing adhesiveness or solder heat resistance, and a laminate and a flexible printed wiring board using the same. The adhesive resin composition contains an epoxy resin; a thermoplastic resin; a benzoxazine compound; a halogen-free flame retardant; and a curing agent, in which at least one of the epoxy resin and the thermoplastic resin contains a phosphorus-containing resin, and the phosphorus content in the solid portion of the adhesive resin composition is 2.5% by mass or more. Preferably, a phosphorus-containing epoxy resin is used as the epoxy resin, a thermoplastic resin containing 10% to 70% by mass of a phosphorus-containing polyester is used as the thermoplastic resin, and the amount of benzoxazine is 5 to 25 parts by mass and the amount of halogen-free flame retardant is 1 to 30 parts by mass per 100 parts of the resins.
    Type: Application
    Filed: January 18, 2010
    Publication date: December 15, 2011
    Inventors: Shingo Kaimori, Jun Sugawara, Akira Mizoguchi, Syougo Asai, Takuma Yoshisaka, Naota Uenishi