Patents by Inventor Syouichi Itoh
Syouichi Itoh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20230312912Abstract: To provide a novel resin having excellent dielectric properties, a method for producing the resin, a curable resin composition, and a cured product. The resin contains constituent units described in Group (1). R1 each independently represent a methylene group, a methylene oxy group, a methylene oxy methylene group, or an oxy methylene group. R2 and R3 each independently represent a halogen atom, an alkyl group having from 1 to 10 carbons, a halogenated alkyl group having from 1 to 10 carbons, a hydroxy alkyl group having from 1 to 10 carbons, or an aryl group having from 6 to 12 carbons. R4, R5, and R6 each independently represent a hydrogen atom, a halogen atom, an alkyl group having from 1 to 10 carbons, a halogenated alkyl group having from 1 to 10 carbons, a hydroxy group, a hydroxy alkyl group having from 1 to 10 carbons, or an aryl group having from 6 to 12 carbons.Type: ApplicationFiled: July 2, 2021Publication date: October 5, 2023Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Takuya UOTANI, Yoichi TAKANO, Susumu INNAN, Syouichi ITOH, Satoshi YOSHINAKA, Mika SUZUKI, Masashi OGIWARA, Hiroaki OKA
-
Publication number: 20220185830Abstract: Provided is a method for producing a silane compound, which does not produce corrosive substances such as acids, does not use organic solvents and which contributes to a reduction in environmental load. This method for producing a silane compound has D) a siloxane decomposition step for heating a mixture containing: a siloxane compound A), which is a cyclic siloxane compound A-1) represented by formula (1), a linear siloxane compound A-2) represented by formula (2) and/or a silsesquioxane compound that is represented by formula (3) and has a siloxane bond as a main chain skeleton; a carbonate compound B) including at least one of a diaryl carbonate, a dialkyl carbonate and a monoalkylmonoaryl carbonate; and a basic compound catalyst C). The step D) further includes subjecting the siloxane compound A) to alkoxylation and/or aryloxylation. (In the formulae, R1 to R5, X, n, m and pare as described in the description of the present application.Type: ApplicationFiled: March 19, 2020Publication date: June 16, 2022Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kazuyoshi UERA, Syouichi ITOH, Kohei KAMATANI
-
Patent number: 10028377Abstract: Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).Type: GrantFiled: August 24, 2012Date of Patent: July 17, 2018Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Naoki Oka, Syouichi Itoh, Masataka Kudo, Michio Yaginuma
-
Patent number: 9394439Abstract: A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.Type: GrantFiled: March 14, 2013Date of Patent: July 19, 2016Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syouichi Itoh, Emi Fukasawa, Yoshitaka Ueno, Michio Yaginuma
-
Patent number: 9199434Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.Type: GrantFiled: April 28, 2014Date of Patent: December 1, 2015Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kenichi Mori, Syouichi Itoh
-
Publication number: 20150017449Abstract: A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.Type: ApplicationFiled: March 14, 2013Publication date: January 15, 2015Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Syouichi Itoh, Emi Fukasawa, Yoshitaka Ueno, Michio Yaginuma
-
Publication number: 20140370771Abstract: Provided are a resin composition having excellent electrical characteristics and heat resistance after moisture absorption, and being also excellent in flowing characteristics at the time of production of a laminate, and a prepreg, a metal foil-clad laminate and a resin sheet using the same. Used is a resin composition comprising a bifunctional phenylene ether oligomer (a) having a polyphenylene ether skeleton, an aralkyl-based cyanate ester compound (b), a bisphenol-based cyanate ester compound (c), an epoxy resin (d), a brominated carbonate oligomer (e), an inorganic filler (f), an alkoxynaphthol-based polymerization inhibitor (g) and/or a thioether-based polymerization inhibitor (h).Type: ApplicationFiled: August 24, 2012Publication date: December 18, 2014Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Naoki Oka, Syouichi Itoh, Masataka Kudo, Michio Yaginuma
-
Publication number: 20140235126Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.Type: ApplicationFiled: April 28, 2014Publication date: August 21, 2014Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.Inventors: Kenichi MORI, Syouichi ITOH
-
Patent number: 8748541Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.Type: GrantFiled: February 11, 2009Date of Patent: June 10, 2014Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kenichi Mori, Syouichi Itoh
-
Publication number: 20090203279Abstract: A vinyl-compound-based resin composition containing a terminal vinyl compound (a) of a bifunctional phenylene ether oligomer having a polyphenylene ether skeleton, a specific maleimide compound (b), a naphthol aralkyl type cyanate ester resin (c) and a naphthalene-skeleton-modified novolak type epoxy resin (d) for a high-multilayer and high-frequency printed wiring board, which resin composition is excellent in varnish shelf life at low temperature and does not show a decrease in multilayer moldability, heat resistance after moisture absorption, electrical characteristics and peel strength even in a winter period and for a long period of time, and a prepreg, a metal-foil-clad laminate and a resin sheet each of which uses the above resin composition.Type: ApplicationFiled: February 11, 2009Publication date: August 13, 2009Inventors: Kenichi Mori, Syouichi Itoh