Patents by Inventor Syouichi Tomida

Syouichi Tomida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Epoxy resins, epoxy resin mixtures, epoxy resin compositions and products of curing of the same
    Patent number: 6812318
    Abstract: The object of the present invention is to provide an epoxy resin and epoxy resin composition having a low viscosity which can afford a cured product having an excellent heat resistance. The present invention is characterized by using an epoxy resin which is obtained by reacting 5-methylresorcin with epihalohydrin in the presence of alkali metal hydroxide.
    Type: Grant
    Filed: July 18, 2002
    Date of Patent: November 2, 2004
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Yasumasa Akatsuka, Koji Nakayama, Katsuhiko Oshimi, Syouichi Tomida
  • Polyphenol resin, method for producing the same, epoxy resin composition and use thereof
    Publication number: 20040166326
    Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product.
    Type: Application
    Filed: February 26, 2004
    Publication date: August 26, 2004
    Inventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida
  • Polyphenol resin, process for its production, epoxy resin composition and its use
    Patent number: 6723801
    Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: April 20, 2004
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida
  • Epoxy resins, epoxy resin mixtures, epoxy resin compositions and products of curing of the same
    Publication number: 20030065109
    Abstract: The object of the present invention is to provide an epoxy resin and epoxy resin composition having a low viscosity which can afford a cured product having an excellent heat resistance. The present invention is characterized by using an epoxy resin which is obtained by reacting 5-methylresorcin with epihalohydrin in the presence of alkali metal hydroxide.
    Type: Application
    Filed: July 25, 2002
    Publication date: April 3, 2003
    Inventors: Yasumasa Akatsuka, Koji Nakayama, Katsuhiko Oshimi, Syouichi Tomida
  • Polyphenol resin, process for its production, epoxy resin composition and its use
    Publication number: 20030009001
    Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product.
    Type: Application
    Filed: May 31, 2002
    Publication date: January 9, 2003
    Inventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida