Patents by Inventor Syouji Someno

Syouji Someno has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5325269
    Abstract: An apparatus according to the present invention is capable of housing a plurality of plug-in packages, each plug-in package being provided with a first connector. The apparatus includes, a housing having a front panel on which a plurality of insertion openings is provided through which openings the plug-in packages can be inserted into the housing, a first edge of each of the plug-in packages leading and a second edge of each of the plug-in packages trailing when inserting, a mother board mounted in the housing, the mother board having a plurality of second connectors fixed thereon, each second connector corresponding to one of the insertion openings formed on the panel, and a supporting member for pivotably supporting the first edge of each of the plug-in packages which was inserted in the housing so that the first connector faces to a corresponding one of the second connectors of the mother board.
    Type: Grant
    Filed: May 4, 1992
    Date of Patent: June 28, 1994
    Assignee: Fujitsu Limited
    Inventor: Syouji Someno
  • Patent number: 5208734
    Abstract: Disclosed herein is a housing for a compact electronic equipment, which is constituted of a metal-base printed wiring board as a lower housing and a cover removably coupled to the lower housing. A metal base of the metal-base printed wiring board is exposed to the atmosphere, and a plurality of surface mounting devices are mounted on a surface of the metal base. As the metal-base printed wiring board is utilized as a part of the housing, it is not necessary to independently provide a printed wiring board for mounting electronic devices thereon, thereby realizing a compact construction of the electronic equipment. Furthermore, as the surface mounting devices are mounted on the metal-base printed wiring board forming a part of the housing, a radiation characteristic of the electronic equipment can be improved.
    Type: Grant
    Filed: March 16, 1992
    Date of Patent: May 4, 1993
    Assignee: Fujitsu Limited
    Inventor: Syouji Someno