Patents by Inventor Syoung Asai

Syoung Asai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ADHESIVE RESIN COMPOSITION, AND LAMINATE AND FLEXIBLE PRINTED WIRING BOARD USING THE SAME
    Publication number: 20120043118
    Abstract: Provided is an adhesive resin composition containing (A) an epoxy resin and/or a phenoxy resin; (B) an epoxy-containing styrene copolymer containing a monomer unit having an epoxy group and a styrene monomer unit; (C) a thermoplastic resin; and (D) a curing agent, in which the content percentage of the epoxy-containing styrene copolymer (B) relative to the total amount of the resin components contained in the adhesive resin composition is 3% to 25% by mass. The adhesive resin composition is a halogen-free adhesive composition having good flame retardancy and a high peel strength. Also provided are a laminate and a flexible printed wiring board that use the adhesive resin composition.
    Type: Application
    Filed: March 26, 2010
    Publication date: February 23, 2012
    Applicants: SUMITOMO ELECTRIC PRINTED CIRCUITS, INC., SUMITOMO ELECTRIC INDUSTRIES, LTD.
    Inventors: Shingo Kaimori, Jun Sugawara, Akira Mizoguchi, Syoung Asai, Takuma Yoshisaka, Naota Uenishi