Patents by Inventor Syozo Mizumoto

Syozo Mizumoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composite material with improved binding strength and method for forming the same
    Publication number: 20050164020
    Abstract: This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.
    Type: Application
    Filed: January 24, 2005
    Publication date: July 28, 2005
    Applicant: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Masaru Kusaka, Koichi Yomogida, Hidemi Nawafune, Syozo Mizumoto, Shingo Ikeda
  • Composite material with improved binding strength and method for forming the same
    Publication number: 20040072015
    Abstract: This invention offers a composite material with improved binding strength and a method for its manufacture. In particular, the invention offers a composite material having metal at the surface of a resin base, obtained by subjecting the surface of a resin base to an ion exchange group introduction treatment, treating the surface of said resin base with liquid containing metal ions, and then reducing said metal ions, where the aforementioned composite material resin is characterized in that the resin base and metal of said composite material are hot-pressed. Said composite material has superior binding strength between resin base and metal relative to composite materials obtained by electroless plating which have inferior binding strength between resin base and metal. Moreover, said composite material is readily manufactured because hot-press methods can be used in the formation of said composite material.
    Type: Application
    Filed: December 27, 2001
    Publication date: April 15, 2004
    Applicant: Shipley Company, L.L.C.
    Inventors: Masaru Seita, Hideki Tsuchida, Masaaki Imanari, Masaru Kusaka, Koichi Yomogida, Hidemi Nawafune, Syozo Mizumoto, Shingo Ikeda