Abstract: A surface-mount network device which is to be mounted on a mounting substrate is disclosed. This device has an insulating substrate having wirings and passive elements. A plurality of lead terminals sandwich the insulating substrate from an end face of the insulating substrate. Terminal connection conductors are formed on the main surfaces of the insulating substrate and connect the lead terminals and at least one of the wirings and the passive elements. Sealing material cover at least connecting portions between the terminal connection conductors and the lead terminals. End portions of the lead terminals are bent to extend in a direction substantially parallel to the mounting substrate. This device is to be mounted vertically on the mounting substrate through the bent end portions of the lead terminals.