Patents by Inventor Syozo Yano

Syozo Yano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer-dicing adhesive tape and method of producing chips using the same
    Patent number: 7985474
    Abstract: A wafer-dicing adhesive tape, containing two or more removable adhesive layers, on a base film, that have resin compositions containing a radiation-polymerizable compound, in which a content of the radiation-polymerizable compound in the resin composition constituting an outermost removable adhesive layer is different from that of an inner removable adhesive layer and a stress applied to the base film is sufficiently introduced to the outermost removable adhesive layer irradiated with radiation, so that said layer can be easily peeled off from chips cut; and a method of producing chips using the same.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: July 26, 2011
    Assignee: The Furukawa Electric Co., Ltd.
    Inventors: Akira Yabuki, Syozo Yano
  • Wafer-dicing adhesive tape and method of producing chips using the same
    Publication number: 20080008881
    Abstract: A wafer-dicing adhesive tape, containing two or more removable adhesive layers, on a base film, that have resin compositions containing a radiation-polymerizable compound, in which a content of the radiation-polymerizable compound in the resin composition constituting an outermost removable adhesive layer is different from that of an inner removable adhesive layer and a stress applied to the base film is sufficiently introduced to the outermost removable adhesive layer irradiated with radiation, so that said layer can be easily peeled off from chips cut; and a method of producing chips using the same.
    Type: Application
    Filed: August 28, 2007
    Publication date: January 10, 2008
    Inventors: Akira Yabuki, Syozo Yano