Abstract: A manufacturing method of a solid state imaging apparatus comprises the steps of preparing a semiconductor wafer on which a plurality of solid state imaging devices are formed, grinding an opposite side of a surface of the semiconductor wafer where the solid state imaging devices are formed, attaching the back grinded semiconductor wafer to a dicing ring via a dicing tape, performing a hydrophilicizing process to the back grinded semiconductor wafer attached to the dicing ring and to an adhesive of the dicing tape, dicing the hydrophilicized semiconductor wafer by a dicing blade and removing adhering material appeared by the dicing by performing rinsing that gives a low damage to the solid state imaging device. The manufacturing method of a solid state imaging apparatus wherein a dicing process can be performed without decreasing an optical property of a solid state imaging device can be provided.