Abstract: A pixel circuit includes a driving circuit, a lighting element, and multiple switching circuits. The driving circuit is configured to provide a driving current to a first node. A first terminal of the lighting element is coupled with a second node. A second terminal of the lighting element is configured to receive a system low voltage. The multiple switching circuits are coupled between the first node and the second node in a parallel connection, and configured to correspondingly receive multiple emission control signals and at least one grayscale control signal. During each frame, the multiple emission control signals provide multiple pulses, and the multiple pulses do not mutually overlapping in time sequence, so that the multiple switching circuits selectively couple the first node to the second node according to the multiple pulses and the at least one grayscale control signal.

Abstract: A pixel circuit includes a driving circuit, a lighting element, and multiple switching circuits. The driving circuit is configured to provide a driving current to a first node. A first terminal of the lighting element is coupled with a second node. A second terminal of the lighting element is configured to receive a system low voltage. The multiple switching circuits are coupled between the first node and the second node in a parallel connection, and configured to correspondingly receive multiple emission control signals and at least one grayscale control signal. During each frame, the multiple emission control signals provide multiple pulses, and the multiple pulses do not mutually overlapping in time sequence, so that the multiple switching circuits selectively couple the first node to the second node according to the multiple pulses and the at least one grayscale control signal.

Abstract: The disclosure generally relates to power over fiber technology configured to provide electrical power and communications via fiber to one or more sensors of one or more varieties. More particularly, the disclosure relates to a sensor system comprising a laser data module operatively connected to a powered sensor module, wherein the powered sensor module receives a light, converts the light to electrical power, and powers a sensor with the electrical power, and wherein the powered sensor module transmits signals from the sensor to a laser data module.

Abstract: The disclosure generally relates to power over fiber technology configured to provide electrical power and communications via fiber to one or more sensors of one or more varieties. More particularly, the disclosure relates to a sensor system comprising a laser data module operatively connected to a powered sensor module, wherein the powered sensor module receives a light, converts the light to electrical power, and powers a sensor with the electrical power, and wherein the powered sensor module transmits signals from the sensor to a laser data module.

Abstract: A method for creating a graphical representation of data includes: obtaining at least one data set of financial data of a company including a first statistic value corresponding to a first time segment of a specific time period, and a second statistic value corresponding to a second time segment of the specific time period different from the first time segment; calculating a comparison value by comparing the first and second statistic values; and generating heat map data used to graphically represent the comparison value in a heat map, the heat map including at least one frame that contains a name associated with the at least one entry of financial data and that is filled by a color based on the comparison value.

Abstract: An energy conversion device in electrical communication with at least one fin is provided to output multiple voltages. The at least one fin which is originating from inside the energy conversion device, which is formed from a metal contact disposed between energy conversion device components, and which is spaced with a first end contact and a second end contact. A power transistor module includes at least one transistor, a gate driver and the energy conversion device. The gate driver is configured to drive the at least one transistor. The energy conversion device is configured to supply isolated voltages to the gate driver.

Abstract: New high energy operating regimes for high intensity energy transfer for beam receiving, signal acquisition, and beam or signal generation for power beaming and wireless power transmission are made possible by new direct thermal pathways for heat sinking, where an energy conversion device comprises a plurality of fins [1] originating from inside the energy conversion device; [2] formed from an energy conversion device component; and where those fins [3] individually support traffic in energy carriers essential to the function of the energy conversion device. This allows high energy thermal interfacing and high intensity energy conversion, such as for receiving and transducing extremely high intensity light shined onto a small surface semiconductor device such as a vertical multijunction photovoltaic receiver. This allows high intensity energy transfer for beam receiving, signal acquisition, and beam or signal generation for high intensity power beaming and wireless power transmission.

Abstract: Thermal, electrical and/or optical interfacing for three-dimensional optoelectronic devices, such as semiconductor device billets, allows high intensity operation, such as for receiving and transducing extremely high intensity light shined onto a small surface semiconductor optoelectronic device such as a photovoltaic receiver or cell, transducer, waveguide or splitter. This allows high intensity energy transfer for beam receiving, signal acquisition, and beam or signal generation for high intensity power beaming and wireless power transmission. Preferred embodiments include three-dimensional photovoltaic receiver billets capable of receiving thousands of suns intensity or high intensity laser light for power conversion, such as by using edge-illuminated vertical multijunction photovoltaic receivers. Heat sink holding structures assist in thermal and electromagnetic communication with opposing billet surfaces.