Patents by Inventor Syuan-Ye Chen

Syuan-Ye Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240113002
    Abstract: The present technology can include a semiconductor device assembly comprising an RDL with a top surface and a side surface intersecting the top surface. The assembly can further comprise a semiconductor device coupled to the top surfaces, and a mold material encasing the semiconductor device (when included) and directly coupled to at least a portion of the top surface and the side surface of the RDL. In other embodiments, the assembly can comprise an RDL with a top surface, a bottom surface opposite thereto, and a sloped side surface extending between the top surface and the bottom surface. The assembly similarly can further comprise a semiconductor device coupled to the top surface, and a mold material encasing the semiconductor device and directly coupled to at least a portion of the top surface and the side surface of the RDL.
    Type: Application
    Filed: September 29, 2023
    Publication date: April 4, 2024
    Inventors: Ya Ling Huang, Jong Sik Paek, Lihao Lyu, Syuan-Ye Chen