Abstract: An LED device includes a die carrier having a die mounting surface and electrical connection regions. An LED die is mounted on the die mounting surface of the die carrier. The LED die includes a substrate, a first type semiconductor layer disposed atop the substrate, a second type semiconductor layer disposed atop the first type semiconductor layer, an another first type semiconductor layer disposed atop the second type semiconductor layer, at least three through holes each extending from the substrate to a corresponding semiconductor layer, an insulative layer formed on inner walls of the through holes, and electrically conductive linkers mounted within the through holes. Each electrically conductive linker has an end electrically connected to a corresponding semiconductor layer and an opposite end protruding outwardly from the corresponding through hole for electrical connection to a corresponding electrical connection region. A light transmissible protective layer covers the LED die.

Abstract: A light-emitting device includes: a transparent substrate including a mounting surface, a circuit path formed on the mounting surface, and two opposite contacts formed on the mounting surface; a light-emitting diode chip that includes two electrodes and that is mounted on the mounting surface; and a reflecting cup disposed on the mounting surface to cover the light-emitting diode chip. The reflecting cup is formed with an inner recess that faces the mounting surface, and a reflecting layer formed on a recess-defining wall that defines the inner recess. The reflecting layer is capable of reflecting light from the light-emitting diode chip toward the transparent substrate.

Abstract: An LED device includes an LED chip having a sapphire substrate, a first-type semiconductor layer on the substrate, a second-type semiconductor layer disposed on the first-type semiconductor layer, a first via hole passing through the sapphire substrate and the first-type semiconductor layer, a second via hole passing through the sapphire substrate, and an insulation layer coated on an inner wall of the first via hole; a transparent conductive layer made of electrically conductive material and formed on the second-type semiconductor layer; a cover layer formed on the transparent conductive layer; electrical conductors, each disposed within one of the via holes, wherein the electrical conductor in the first via hole is electrically connected to the second-type semiconductor layer and the electrical conductor in the second via hole is electrically connected to the first-type semiconductor layer; and two linkers for connection to external circuitry, formed on a surface of the sapphire.

Abstract: An LED device includes a die carrier having a die mounting surface and electrical connection regions. An LED die is mounted on the die mounting surface of the die carrier. The LED die includes a substrate, a first type semiconductor layer disposed atop the substrate, a second type semiconductor layer disposed atop the first type semiconductor layer, an another first type semiconductor layer disposed atop the second type semiconductor layer, at least three through holes each extending from the substrate to a corresponding semiconductor layer, an insulative layer formed on inner walls of the through holes, and electrically conductive linkers mounted within the through holes. Each electrically conductive linker has an end electrically connected to a corresponding semiconductor layer and an opposite end protruding outwardly from the corresponding through hole for electrical connection to a corresponding electrical connection region. A light transmissible protective layer covers the LED die.

Abstract: A backlight device includes a mounting substrate having circuit traces laid out in a predetermined pattern on a mounting surface thereof. A plurality of light-emitting elements are connected electrically to the circuit traces. A diffusion film assembly includes a first diffusion film disposed above the light-emitting elements, and a second diffusion film disposed between the first diffusion film and the light-emitting elements and having a plurality of protrusions each projecting toward a respective light-emitting element. The first diffusion film reflects twice the light that passes through the second diffusion film and balances once again the light, so that the light transmits uniformly to a thin film transistor glass.

Abstract: A light-emitting device includes: a transparent substrate including a mounting surface, a circuit path formed on the mounting surface, and two opposite contacts formed on the mounting surface; a light-emitting diode chip that includes two electrodes and that is mounted on the mounting surface; and a reflecting cup disposed on the mounting surface to cover the light-emitting diode chip. The reflecting cup is formed with an inner recess that faces the mounting surface, and a reflecting layer formed on a recess-defining wall that defines the inner recess. The reflecting layer is capable of reflecting light from the light-emitting diode chip toward the transparent substrate.

Abstract: A heat sink includes a first plate having a first surface with a heat source contact region, and a second surface has a looped peripheral groove, and first to nth evaporation/condensation grooved sections arranged sequentially within the looped peripheral groove. Each grooved section has parallel grooves. The first grooved section is disposed in an area corresponding to the contact region, and each groove therein has a leading end connected to the looped peripheral groove. Every two grooves in each of the second to nth grooved sections have leading ends connected to a trailing end of one groove in the preceding grooved section. The grooves in the nth grooved section having trailing ends connected to the looped peripheral groove.

Abstract: An integrated circuit (IC) card is adapted for exchanging data with an external computer device, and includes an IC chip for storing owner fingerprint data, a fingerprint scanner, and a control unit coupled electrically to the IC chip and the fingerprint scanner. The control unit includes a central processing unit operatively associated with the IC chip and the fingerprint scanner. The central processing unit is configured to compare user fingerprint data inputted via the fingerprint scanner with the owner fingerprint data stored in the IC chip, and to enable the control unit to conduct a transaction with the external computer device when the user fingerprint data matches the owner fingerprint data.