Patents by Inventor Syug-Ming Jang

Syug-Ming Jang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-step plasma treatment method to improve CU interconnect electrical performance
    Publication number: 20050158999
    Abstract: A method for plasma treating an exposed copper surface and dielectric insulating layer in a semiconductor device manufacturing process including providing a semiconductor wafer having a process surface including an exposed copper portion and an exposed dielectric insulating layer portion; plasma treating in a first plasma treatment process, the process surface with a first plasma including ammonia (NH3) and nitrogen (N2) plasma to form a copper nitride layer overlying the exposed copper portion; and, plasma treating in a second plasma treatment process the process surface with a second plasma including oxygen (O2).
    Type: Application
    Filed: January 20, 2004
    Publication date: July 21, 2005
    Inventors: Keng-Chu Lin, Hui-Lin Chang, I-I Chen, Yung-Chen Lu, Syug-Ming Jang