Abstract: An electronic device includes: a wiring board; an electric connection wiring connected to a power supply; motor connection wirings arranged on a peripheral side of the wiring board and connected to the electric motor; and semiconductor modules having semiconductor elements and a resin mold. The semiconductor modules are arranged at a position on the electric connection wiring or on the peripheral side of the electric connection wiring and on a center side of the motor connection wiring. At least a part of electrodes of the plurality of semiconductor modules is mounted on the electric connection wiring.

Abstract: A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.

Abstract: A semiconductor module includes: two semiconductor elements stacked in a vertical direction to overlap at least a part of the semiconductor elements; a conductive member stacked on the semiconductor elements and electrically connected to at least one of the semiconductor elements; and a resin mold integrally sealing the semiconductor elements and the conductive member. A lower semiconductor element has at least observable positions of both ends of two sides substantially orthogonal to each other when viewed from above in the vertical direction without arranging the resin mold.

Abstract: An electronic device includes a semiconductor device, a wiring board, a heat dissipating member, and a housing. The semiconductor device includes a semiconductor element, a conductive member electrically connected to the semiconductor element, and a resin mold sealing the semiconductor element. The wiring board includes a wiring portion on which the semiconductor device is mounted, and a resist portion disposed around the wiring portion. The heat dissipating member is in thermal contact with at least one of surfaces of the semiconductor device. The housing is in thermal contact with the semiconductor device through the heat dissipating member. Each of the resin mold and the heat dissipating member has a thermal conductivity higher than that of the resist portion.

Abstract: An electric steering device includes a motor and a control circuit. The motor applies a steering force to a steering mechanism of a vehicle. The control circuit includes an inverter that converts DC power of a DC power supply to AC power and supplies the AC power to the motor, and a power supply relay that permits or blocks a current flow to the motor through the inverter. In the control circuit, the power supply relay is provided on a ground line connecting the inverter and a ground.

Abstract: A semiconductor device is to be mounted on a mount object by a solder. The semiconductor device includes a semiconductor element, an insulation member, and a plurality of terminals. The semiconductor element includes a plurality of electrodes. The insulation member covers the semiconductor element. The plurality of terminals is electrically connected to the plurality of electrodes. At least a part of the plurality of terminals is exposed outside the insulation member.

Abstract: An electric steering device includes a motor and a control circuit. The motor applies a steering force to a steering mechanism of a vehicle. The control circuit includes an inverter that converts DC power of a DC power supply to AC power and supplies the AC power to the motor, and a power supply relay that permits or blocks a current flow to the motor through the inverter. In the control circuit, the power supply relay is provided on a ground line connecting the inverter and a ground.

Abstract: Two power modules, in which switching elements for switching over currents supplied to coils of a motor are resin-molded, are provided to face each other sandwiching a plane including a rotation axis of a shaft. A first smoothing capacitor, second smoothing capacitors and a choke coil are located between the power modules. By consolidating large-sized electronic parts between the power modules, a control unit can be reduced in size and impedance of electric conductor connecting the electronic parts and the power modules can be reduced.

Abstract: An electric power converter includes: a heat sink having a heat receiving surface; a semiconductor module including a metal plate having a heat radiation surface, a switching element on the metal plate opposite to the heat radiation surface, and a resin member covering a part of the metal plate and the switching element; a heat radiation member between the heat receiving surface and the semiconductor module for transmitting heat of the switching element to the heat receiving surface via the metal plate. The heat receiving surface includes a concavity, and the heat radiation surface includes a convexity. The heat radiation member has a predetermined area sandwiched between the concavity and the convexity.

Abstract: An electric power converter includes: a heat sink having a heat receiving surface; a semiconductor module including a metal plate having a heat radiation surface, a switching element on the metal plate opposite to the heat radiation surface, and a resin member covering a part of the metal plate and the switching element; a heat radiation member between the heat receiving surface and the semiconductor module for transmitting heat of the switching element to the heat receiving surface via the metal plate. The heat receiving surface includes a concavity, and the heat radiation surface includes a convexity. The heat radiation member has a predetermined area sandwiched between the concavity and the convexity.

Abstract: Two power modules, in which switching elements for switching over currents supplied to coils of a motor are resin-molded, are provided to face each other sandwiching a plane including a rotation axis of a shaft. A first smoothing capacitor, second smoothing capacitors and a choke coil are located between the power modules. By consolidating large-sized electronic parts between the power modules, a control unit can be reduced in size and impedance of electric conductor connecting the electronic parts and the power modules can be reduced.