Patents by Inventor Syuichi Ichikawa

Syuichi Ichikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Honeycomb structure
    Patent number: 8039085
    Abstract: There is provided a honeycomb structure 10 comprising a honeycomb segment joined body 10 having a plurality of honeycomb segments 2 integrally joined with one another at a joint face of each of the honeycomb segments by means of a bonding material layer 9 and having a plurality of cells 5 functioning as fluid passages disposed in parallel with one another in a direction of central axis. Porosity in an outside portion of the bonding material layer 9 (portion from the interface of the joint face of honeycomb segments to the point corresponding to 20% thickness of the total bonding material layer) is smaller than that in the central portion located on the inner side of the outside portion.
    Type: Grant
    Filed: March 7, 2006
    Date of Patent: October 18, 2011
    Assignee: NGK Insulators, Ltd.
    Inventors: Syuichi Ichikawa, Koichi Iwata, Naoshi Masukawa, Atsushi Watanabe
  • Honeycomb Structure
    Publication number: 20080187712
    Abstract: There is provided a honeycomb structure 10 comprising a honeycomb segment joined body 10 having a plurality of honeycomb segments 2 integrally joined with one another at a joint face of each of the honeycomb segments by means of a bonding material layer 9 and having a plurality of cells 5 functioning as fluid passages disposed in parallel with one another in a direction of central axis. Porosity in an outside portion of the bonding material layer 9 (portion from the interface of the joint face of honeycomb segments to the point corresponding to 20% thickness of the total bonding material layer) is smaller than that in the central portion located on the inner side of the outside portion.
    Type: Application
    Filed: March 7, 2006
    Publication date: August 7, 2008
    Inventors: Syuichi Ichikawa, Koichi Iwata, Naoshi Masukawa, Atsushi Watanabe