Patents by Inventor Syuichi Monma

Syuichi Monma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device, method of manufacturing semiconductor device and a method of manufacturing lead frame
    Publication number: 20030132533
    Abstract: A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.
    Type: Application
    Filed: February 25, 2003
    Publication date: July 17, 2003
    Applicant: FUJITSU LIMITED
    Inventors: Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi
  • Semiconductor device including stud bumps as external connection terminals
    Patent number: 6541848
    Abstract: A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.
    Type: Grant
    Filed: October 13, 1998
    Date of Patent: April 1, 2003
    Assignee: Fujitsu Limited
    Inventors: Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi
  • SEMICONDUCTOR DEVICE INCLUDING STUD BUMPS AS EXTERNAL CONNECTION TERMINALS
    Publication number: 20020105069
    Abstract: A semiconductor device includes a semiconductor chip, a resin package for sealing said semiconductor chip, metal layers provided on a mounting-side surface of said resin package in an exposed manner and connecting members for electrically connecting electrode pads provided on the semiconductor chip and the metal layers. The metal layers are provided with stud bumps on the mounting side, the stud bumps serving as external connection terminals.
    Type: Application
    Filed: October 13, 1998
    Publication date: August 8, 2002
    Inventors: TOSHIMI KAWAHARA, MAMORU SUWA, MASANORI ONODERA, SYUICHI MONMA, SHINYA NAKASEKO, TAKASHI HOZUMI
  • Semiconductor device and mounting structure
    Patent number: 6329711
    Abstract: A semiconductor device includes a semiconductor element, a resin package sealing the semiconductor element, resin projections protruding from a mounting surface of the resin package, metallic film parts provided to the resin projections, connecting members electrically connecting electrode pads on the semiconductor element and the metallic film parts, and connection pads extending from the metallic film parts, the connecting members being connected to the connection pads.
    Type: Grant
    Filed: November 30, 1998
    Date of Patent: December 11, 2001
    Assignee: Fujitsu Limited
    Inventors: Toshimi Kawahara, Mamoru Suwa, Masanori Onodera, Syuichi Monma, Shinya Nakaseko, Takashi Hozumi, Yoshiyuki Yoneda, Ryuji Nomoto