Patents by Inventor Syuji Ichimura
Syuji Ichimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10822526Abstract: A method for manufacturing adhesive resin pellets includes adding an antiblocking agent to water, melting an adhesive resin and extruding the adhesive resin into the water, and cutting the adhesive resin extruded into the water to form adhesive resin pellets. Polyolefin fine particles used for the antiblocking agent have an average particle diameter of 1 ?m or more and less than 18 ?m, and the adhesive resin has an adhesive force of less than 15.00 N/25 mm.Type: GrantFiled: December 18, 2015Date of Patent: November 3, 2020Assignee: Nichiban Co., Ltd.Inventors: Syuji Ichimura, Mikihiro Endou, Yusuke Sugiyama
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Publication number: 20180104855Abstract: A method for manufacturing adhesive resin pellets includes adding an antiblocking agent to water, melting an adhesive resin and extruding the adhesive resin into the water, and cutting the adhesive resin extruded into the water to form adhesive resin pellets. Polyolefin fine particles used for the antiblocking agent have an average particle diameter of 1 ?m or more and less than 18 ?m, and the adhesive resin has an adhesive force of less than 15.00 N/25 mm.Type: ApplicationFiled: December 18, 2015Publication date: April 19, 2018Inventors: Syuji ICHIMURA, Mikihiro ENDOU, Yusuke SUGIYAMA
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Patent number: 9586388Abstract: A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive, which may be an acrylic pressure-sensitive adhesive, is placed over the polyolefin-based polymer layer. The chip-resistant film may also include an intermediate adhesive layer positioned between the ionomer layer and the polyolefin-based polymer layer. The chip resistance of an object to which the chip-resistant film has been applied is improved.Type: GrantFiled: December 9, 2014Date of Patent: March 7, 2017Assignee: NICHIBAN CO., LTD.Inventors: Syuji Ichimura, Masataka Sudo, Tomohisa Kato
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Publication number: 20150090391Abstract: A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive, which may be an acrylic pressure-sensitive adhesive, is placed over the polyolefin-based polymer layer. The chip-resistant film may also include an intermediate adhesive layer positioned between the ionomer layer and the polyolefin-based polymer layer. The chip resistance of an object to which the chip-resistant film has been applied is improved.Type: ApplicationFiled: December 9, 2014Publication date: April 2, 2015Inventors: Syuji ICHIMURA, Masataka SUDO, Tomohisa KATO
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Patent number: 8962125Abstract: An anti-chipping sheet includes at least a substrate layer and a pressure-sensitive adhesive layer, wherein the substrate layer comprises laminated multiple ionomer layers, each of which comprises an ionomer produced by neutralizing carboxyl groups of an ethylene-unsaturated carboxylic acid copolymer with metal ions, one of the multiple ionomer layers is a high-rigidity ionomer layer, located at the outermost layer and not in contact with the pressure-sensitive adhesive layer of the substrate layer, and having stiffness of 200 N/mm2 or higher, and another one of the multiple ionomer layers is a low-rigidity ionomer layer, located toward the pressure-sensitive adhesive layer in relation to the outermost layer, and having stiffness of lower than 200 N/mm2.Type: GrantFiled: January 31, 2008Date of Patent: February 24, 2015Assignee: Nichiban Co., Ltd.Inventors: Syuji Ichimura, Masataka Sudo
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Publication number: 20110020643Abstract: The present invention is directed to a surface protective sheet having a pressure-sensitive adhesive comprised a thermoplastic elastomer as a main component on at least one surface of a substrate, wherein the pressure-sensitive adhesive comprises a hydrogenation product of styrene random copolymer, an amorphous polypropylene elastomer, a tackifier resin, and a softener, wherein hydrogenation product of styrene random copolymer:amorphous polypropylene elastomer is more than 0:less than 100 to less than 80:more than 20, when the total of the hydrogenation product of styrene random copolymer and the amorphous polypropylene elastomer is taken as 100.Type: ApplicationFiled: March 10, 2008Publication date: January 27, 2011Inventors: Mikihiro Endo, Yusuke Sugiyama, Syuji Ichimura
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Publication number: 20110008599Abstract: An anti-chipping sheet includes at least a substrate layer and a pressure-sensitive adhesive layer, wherein the substrate layer comprises laminated multiple ionomer layers, each of which comprises an ionomer produced by neutralizing carboxyl groups of an ethylene-unsaturated carboxylic acid copolymer with metal ions, one of the multiple ionomer layers is a high-rigidity ionomer layer, located at the outermost layer and not in contact with the pressure-sensitive adhesive layer of the substrate layer, and having stiffness of 200 N/mm2 or higher, and another one of the multiple ionomer layers is a low-rigidity ionomer layer, located toward the pressure-sensitive adhesive layer in relation to the outermost layer, and having stiffness of lower than 200 N/mm2.Type: ApplicationFiled: January 31, 2008Publication date: January 13, 2011Applicant: Nichiban Co., Ltd.Inventors: Syuji Ichimura, Masataka Sudo
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Publication number: 20100167049Abstract: A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive is placed over the polyolefin-based polymer layer.Type: ApplicationFiled: December 16, 2005Publication date: July 1, 2010Applicants: NICHIBAN CO., LTD., SAKAE RIKEN KOGYO., LTD.Inventors: Syuji Ichimura, Masataka Sudo, Tomohisa Kato
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Publication number: 20080286571Abstract: The present invention relates to a surface protective sheet having a pressure-sensitive adhesive layer on at least one side of a substrate; wherein, the pressure-sensitive adhesive contains 100 parts by weight of a styrene-isobutylene block copolymer, and 0 to 300 parts by weight of a softening agent and 0 to less than 20 parts by weight of a tackifying resin, both based on 100 parts by weight of the styrene-isobutylene block copolymer.Type: ApplicationFiled: January 16, 2006Publication date: November 20, 2008Applicant: Nichiban Company LimitedInventors: Syuji Ichimura, Mikihiro Endo
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Patent number: 6902786Abstract: The present invention relates to a pressure-sensitive adhesive composition for a surface-protective film, the composition comprising 40% by weight or more of a hydrogenated random copolymer consisting of 1 to 50% by weight of styrene and 99 to 50% by weight of a diene hydrocarbon and 60% by weight or less of a tackifier resin and/or a softener, and when the pressure-sensitive adhesive composition of the present invention is applied to the surface-protective film, the composition is caused to exhibit excellent adhesion to adherends, not to leave stains of the adherends, nor to leaves traces thereon when the films are removed from the adherends, and can also impart excellent removability to surface-protective films.Type: GrantFiled: July 10, 2002Date of Patent: June 7, 2005Assignee: Nichiban Company, LimitedInventors: Yasuaki Kitazaki, Kinnosuke Hino, Syuji Ichimura
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Patent number: 6872447Abstract: The pressure-sensitive adhesive sheet for surface protection has a three-layered film formed by laminating a layer A, a layer B and a layer C in this order and a pressure-sensitive adhesive layer formed on the layer C; wherein the layer A contains a polyethylene in an amount of at least 60% by weight based on a total weight of the layer A; the layer B contains a polypropylene type polymer in an amount of at least 50% by weight of based on a total weight of the layer B; and the layer C contains a hydrogenated styrene/diene type hydrocarbon copolymer in an amount of at least 10% by weight based on the total weight of the layer C. This sheet has excellent weathering resistance to undergo neither chalking nor fracture in the substrate at peeling, even after a prolonged outdoor exposure, develops less corona odor to enable extended operation of applying it, and can be manufactured inexpensively with reduced manufacturing process, since no anchor coat treating procedure is required.Type: GrantFiled: July 11, 2000Date of Patent: March 29, 2005Assignee: Nichiban Company LimitedInventors: Mikihiro Endo, Syuji Ichimura, Kazuhiro Kono, Yoshinaga Tsuzuki
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Publication number: 20030004266Abstract: The present invention relates to a pressure-sensitive adhesive composition for a surface-protective film, the composition comprising 40% by weight or more of a hydrogenated random copolymer consisting of 1 to 50% by weight of styrene and 99 to 50% by weight of a diene type hydrocarbon and 60% by weight or less of a tackifier resin and/or a softener, and when the pressure-sensitive adhesive composition of the present invention is applied to the surface-protective film, the composition is caused to exhibit excellent adhesion to adherends, not to leave stains of the adherends nor to leave traces thereon when the films are removed from the adherends and can also impart excellent removability to surface-protective films.Type: ApplicationFiled: July 10, 2002Publication date: January 2, 2003Applicant: Nichiban Company, Limited from Yasuaki KITAZAKI, Kinnosuke HINO and Syuji ICHIMURAInventors: Yasuaki Kitazaki, Kinnosuke Hino, Syuji Ichimura
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Patent number: 6274235Abstract: The present invention is to provide a pressure-sensitive adhesive sheet for surface protection, which has a substrate containing an ethylene/propylene copolymer and an ethylene/1-butene copolymer in a weight ratio of 60:40 to 90:10, and an adhesive composition for pressure-sensitive adhesive sheets for surface protection, which contains 5 to 30 parts by weight of a rosin resin tackifier based on 100 parts by weight of a blend comprising 50 to 100% by weight of a polyisobutylene and/or a butyl rubber and 50 to 0% by weight of a polybutene.Type: GrantFiled: June 30, 1999Date of Patent: August 14, 2001Assignee: Nichiban Company LimitedInventors: Syuji Ichimura, Yoshinaga Tsuzuki, Kinnosuke Hino, Mikihiro Endo, Kazuhiro Kono
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Patent number: 5965255Abstract: The present invention provides a pressure-sensitive adhesive sheet for surface protection which has been laminated the following three layers of:(A) a layer which contains 60-100% by weight of an elastomer, containing 100-50% by weight of a hydrogenated random copolymer consisting of 1-50% by weight of styrene and 99-50% by weight of a diene hydrocarbon and 0-50% by weight of a low-molecular-weight elastomer, and 40-0% by weight of a polyolefin;(B) a layer which contains 3-95% by weight of a hydrogenated random copolymer consisting of 1-50% by weight of styrene and 99-50% by weight of a diene hydrocarbon and 97-5% by weight of a polyolefin; and(C) a layer which has at least one layer of a polyolefin,which has good adhesion to an object to be adhered, which can be easily removed (peeled off) from an object to be adhered after exposure to carbon arc, which has also good adhesion between the respective layers and which neither stains the surface to which the adhesive sheet is adhered nor leaves any adhesion markType: GrantFiled: September 3, 1998Date of Patent: October 12, 1999Assignee: Nichiban Company LimitedInventors: Syuji Ichimura, Yoshinaga Tsuzuki, Kinnosuke Hino
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Patent number: 5820979Abstract: Disclosed is a surface protective film which comprises:a layer (A) comprising 60% by weight or more of a hydrogenated product of a random copolymer comprising 1 to 50% by weight of styrene and 99 to 50% by weight of diene series hydrocarbon, and 40% by weight or less of a polyolefin; anda layer (B) comprising less than 60% by weight of a hydrogenated product of a random copolymer comprising 1 to 50% by weight of styrene and 99 to 50% by weight of diene series hydrocarbon, and more than 40% by weight of a polyolefin being laminated.Type: GrantFiled: March 8, 1996Date of Patent: October 13, 1998Assignee: Nichiban Co., Ltd.Inventors: Yasuaki Kitazaki, Kinnosuke Hino, Syuji Ichimura