Patents by Inventor Syuji Ichimura

Syuji Ichimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10822526
    Abstract: A method for manufacturing adhesive resin pellets includes adding an antiblocking agent to water, melting an adhesive resin and extruding the adhesive resin into the water, and cutting the adhesive resin extruded into the water to form adhesive resin pellets. Polyolefin fine particles used for the antiblocking agent have an average particle diameter of 1 ?m or more and less than 18 ?m, and the adhesive resin has an adhesive force of less than 15.00 N/25 mm.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: November 3, 2020
    Assignee: Nichiban Co., Ltd.
    Inventors: Syuji Ichimura, Mikihiro Endou, Yusuke Sugiyama
  • Publication number: 20180104855
    Abstract: A method for manufacturing adhesive resin pellets includes adding an antiblocking agent to water, melting an adhesive resin and extruding the adhesive resin into the water, and cutting the adhesive resin extruded into the water to form adhesive resin pellets. Polyolefin fine particles used for the antiblocking agent have an average particle diameter of 1 ?m or more and less than 18 ?m, and the adhesive resin has an adhesive force of less than 15.00 N/25 mm.
    Type: Application
    Filed: December 18, 2015
    Publication date: April 19, 2018
    Inventors: Syuji ICHIMURA, Mikihiro ENDOU, Yusuke SUGIYAMA
  • Patent number: 9586388
    Abstract: A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive, which may be an acrylic pressure-sensitive adhesive, is placed over the polyolefin-based polymer layer. The chip-resistant film may also include an intermediate adhesive layer positioned between the ionomer layer and the polyolefin-based polymer layer. The chip resistance of an object to which the chip-resistant film has been applied is improved.
    Type: Grant
    Filed: December 9, 2014
    Date of Patent: March 7, 2017
    Assignee: NICHIBAN CO., LTD.
    Inventors: Syuji Ichimura, Masataka Sudo, Tomohisa Kato
  • Publication number: 20150090391
    Abstract: A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive, which may be an acrylic pressure-sensitive adhesive, is placed over the polyolefin-based polymer layer. The chip-resistant film may also include an intermediate adhesive layer positioned between the ionomer layer and the polyolefin-based polymer layer. The chip resistance of an object to which the chip-resistant film has been applied is improved.
    Type: Application
    Filed: December 9, 2014
    Publication date: April 2, 2015
    Inventors: Syuji ICHIMURA, Masataka SUDO, Tomohisa KATO
  • Patent number: 8962125
    Abstract: An anti-chipping sheet includes at least a substrate layer and a pressure-sensitive adhesive layer, wherein the substrate layer comprises laminated multiple ionomer layers, each of which comprises an ionomer produced by neutralizing carboxyl groups of an ethylene-unsaturated carboxylic acid copolymer with metal ions, one of the multiple ionomer layers is a high-rigidity ionomer layer, located at the outermost layer and not in contact with the pressure-sensitive adhesive layer of the substrate layer, and having stiffness of 200 N/mm2 or higher, and another one of the multiple ionomer layers is a low-rigidity ionomer layer, located toward the pressure-sensitive adhesive layer in relation to the outermost layer, and having stiffness of lower than 200 N/mm2.
    Type: Grant
    Filed: January 31, 2008
    Date of Patent: February 24, 2015
    Assignee: Nichiban Co., Ltd.
    Inventors: Syuji Ichimura, Masataka Sudo
  • Publication number: 20110020643
    Abstract: The present invention is directed to a surface protective sheet having a pressure-sensitive adhesive comprised a thermoplastic elastomer as a main component on at least one surface of a substrate, wherein the pressure-sensitive adhesive comprises a hydrogenation product of styrene random copolymer, an amorphous polypropylene elastomer, a tackifier resin, and a softener, wherein hydrogenation product of styrene random copolymer:amorphous polypropylene elastomer is more than 0:less than 100 to less than 80:more than 20, when the total of the hydrogenation product of styrene random copolymer and the amorphous polypropylene elastomer is taken as 100.
    Type: Application
    Filed: March 10, 2008
    Publication date: January 27, 2011
    Inventors: Mikihiro Endo, Yusuke Sugiyama, Syuji Ichimura
  • Publication number: 20110008599
    Abstract: An anti-chipping sheet includes at least a substrate layer and a pressure-sensitive adhesive layer, wherein the substrate layer comprises laminated multiple ionomer layers, each of which comprises an ionomer produced by neutralizing carboxyl groups of an ethylene-unsaturated carboxylic acid copolymer with metal ions, one of the multiple ionomer layers is a high-rigidity ionomer layer, located at the outermost layer and not in contact with the pressure-sensitive adhesive layer of the substrate layer, and having stiffness of 200 N/mm2 or higher, and another one of the multiple ionomer layers is a low-rigidity ionomer layer, located toward the pressure-sensitive adhesive layer in relation to the outermost layer, and having stiffness of lower than 200 N/mm2.
    Type: Application
    Filed: January 31, 2008
    Publication date: January 13, 2011
    Applicant: Nichiban Co., Ltd.
    Inventors: Syuji Ichimura, Masataka Sudo
  • Publication number: 20100167049
    Abstract: A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive is placed over the polyolefin-based polymer layer.
    Type: Application
    Filed: December 16, 2005
    Publication date: July 1, 2010
    Applicants: NICHIBAN CO., LTD., SAKAE RIKEN KOGYO., LTD.
    Inventors: Syuji Ichimura, Masataka Sudo, Tomohisa Kato
  • Publication number: 20080286571
    Abstract: The present invention relates to a surface protective sheet having a pressure-sensitive adhesive layer on at least one side of a substrate; wherein, the pressure-sensitive adhesive contains 100 parts by weight of a styrene-isobutylene block copolymer, and 0 to 300 parts by weight of a softening agent and 0 to less than 20 parts by weight of a tackifying resin, both based on 100 parts by weight of the styrene-isobutylene block copolymer.
    Type: Application
    Filed: January 16, 2006
    Publication date: November 20, 2008
    Applicant: Nichiban Company Limited
    Inventors: Syuji Ichimura, Mikihiro Endo
  • Patent number: 6902786
    Abstract: The present invention relates to a pressure-sensitive adhesive composition for a surface-protective film, the composition comprising 40% by weight or more of a hydrogenated random copolymer consisting of 1 to 50% by weight of styrene and 99 to 50% by weight of a diene hydrocarbon and 60% by weight or less of a tackifier resin and/or a softener, and when the pressure-sensitive adhesive composition of the present invention is applied to the surface-protective film, the composition is caused to exhibit excellent adhesion to adherends, not to leave stains of the adherends, nor to leaves traces thereon when the films are removed from the adherends, and can also impart excellent removability to surface-protective films.
    Type: Grant
    Filed: July 10, 2002
    Date of Patent: June 7, 2005
    Assignee: Nichiban Company, Limited
    Inventors: Yasuaki Kitazaki, Kinnosuke Hino, Syuji Ichimura
  • Patent number: 6872447
    Abstract: The pressure-sensitive adhesive sheet for surface protection has a three-layered film formed by laminating a layer A, a layer B and a layer C in this order and a pressure-sensitive adhesive layer formed on the layer C; wherein the layer A contains a polyethylene in an amount of at least 60% by weight based on a total weight of the layer A; the layer B contains a polypropylene type polymer in an amount of at least 50% by weight of based on a total weight of the layer B; and the layer C contains a hydrogenated styrene/diene type hydrocarbon copolymer in an amount of at least 10% by weight based on the total weight of the layer C. This sheet has excellent weathering resistance to undergo neither chalking nor fracture in the substrate at peeling, even after a prolonged outdoor exposure, develops less corona odor to enable extended operation of applying it, and can be manufactured inexpensively with reduced manufacturing process, since no anchor coat treating procedure is required.
    Type: Grant
    Filed: July 11, 2000
    Date of Patent: March 29, 2005
    Assignee: Nichiban Company Limited
    Inventors: Mikihiro Endo, Syuji Ichimura, Kazuhiro Kono, Yoshinaga Tsuzuki
  • Publication number: 20030004266
    Abstract: The present invention relates to a pressure-sensitive adhesive composition for a surface-protective film, the composition comprising 40% by weight or more of a hydrogenated random copolymer consisting of 1 to 50% by weight of styrene and 99 to 50% by weight of a diene type hydrocarbon and 60% by weight or less of a tackifier resin and/or a softener, and when the pressure-sensitive adhesive composition of the present invention is applied to the surface-protective film, the composition is caused to exhibit excellent adhesion to adherends, not to leave stains of the adherends nor to leave traces thereon when the films are removed from the adherends and can also impart excellent removability to surface-protective films.
    Type: Application
    Filed: July 10, 2002
    Publication date: January 2, 2003
    Applicant: Nichiban Company, Limited from Yasuaki KITAZAKI, Kinnosuke HINO and Syuji ICHIMURA
    Inventors: Yasuaki Kitazaki, Kinnosuke Hino, Syuji Ichimura
  • Patent number: 6274235
    Abstract: The present invention is to provide a pressure-sensitive adhesive sheet for surface protection, which has a substrate containing an ethylene/propylene copolymer and an ethylene/1-butene copolymer in a weight ratio of 60:40 to 90:10, and an adhesive composition for pressure-sensitive adhesive sheets for surface protection, which contains 5 to 30 parts by weight of a rosin resin tackifier based on 100 parts by weight of a blend comprising 50 to 100% by weight of a polyisobutylene and/or a butyl rubber and 50 to 0% by weight of a polybutene.
    Type: Grant
    Filed: June 30, 1999
    Date of Patent: August 14, 2001
    Assignee: Nichiban Company Limited
    Inventors: Syuji Ichimura, Yoshinaga Tsuzuki, Kinnosuke Hino, Mikihiro Endo, Kazuhiro Kono
  • Patent number: 5965255
    Abstract: The present invention provides a pressure-sensitive adhesive sheet for surface protection which has been laminated the following three layers of:(A) a layer which contains 60-100% by weight of an elastomer, containing 100-50% by weight of a hydrogenated random copolymer consisting of 1-50% by weight of styrene and 99-50% by weight of a diene hydrocarbon and 0-50% by weight of a low-molecular-weight elastomer, and 40-0% by weight of a polyolefin;(B) a layer which contains 3-95% by weight of a hydrogenated random copolymer consisting of 1-50% by weight of styrene and 99-50% by weight of a diene hydrocarbon and 97-5% by weight of a polyolefin; and(C) a layer which has at least one layer of a polyolefin,which has good adhesion to an object to be adhered, which can be easily removed (peeled off) from an object to be adhered after exposure to carbon arc, which has also good adhesion between the respective layers and which neither stains the surface to which the adhesive sheet is adhered nor leaves any adhesion mark
    Type: Grant
    Filed: September 3, 1998
    Date of Patent: October 12, 1999
    Assignee: Nichiban Company Limited
    Inventors: Syuji Ichimura, Yoshinaga Tsuzuki, Kinnosuke Hino
  • Patent number: 5820979
    Abstract: Disclosed is a surface protective film which comprises:a layer (A) comprising 60% by weight or more of a hydrogenated product of a random copolymer comprising 1 to 50% by weight of styrene and 99 to 50% by weight of diene series hydrocarbon, and 40% by weight or less of a polyolefin; anda layer (B) comprising less than 60% by weight of a hydrogenated product of a random copolymer comprising 1 to 50% by weight of styrene and 99 to 50% by weight of diene series hydrocarbon, and more than 40% by weight of a polyolefin being laminated.
    Type: Grant
    Filed: March 8, 1996
    Date of Patent: October 13, 1998
    Assignee: Nichiban Co., Ltd.
    Inventors: Yasuaki Kitazaki, Kinnosuke Hino, Syuji Ichimura