Abstract: A circuit module and a composite circuit module, which suppress or prevent damage to a connection to or within a device when heat is applied, includes a SAW filter including a piezoelectric substrate. In a package substrate that is a resin substrate, the SAW filter is mounted. A mounting substrate is a multilayer substrate mounted on a mother substrate, and the package substrate is mounted therein.

Abstract: A first filter channel with superior attenuation characteristics for transmission signals and is less susceptible to influence of transmission signals inputted to a transmission SAW filter device, is disposed closer to a transmission terminal, whereas a second filter channel with poor attenuation characteristics in a transmission band and is more susceptible to the influence of transmission signals inputted to the transmission SAW filter device, is disposed farther from a transmission terminal to improve isolation characteristics in a differential mode of a duplexer.

Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

Abstract: An electronic component includes a support layer that surrounds an element region on a principal surface of a piezoelectric substrate, when viewed in plan from a z-axis direction. A surface acoustic wave element is provided in the element region. A cover layer is provided on the support layer, and is opposed to the principal surface. A pillar member connects the principal surface and the cover layer in a space surrounded by the principal surface, the support layer, and the cover layer, and does not contact with the support layer.

Abstract: A SAW filter includes a piezoelectric substrate, a longitudinal coupling portion disposed on a main surface of the piezoelectric substrate, a support layer and cover layers covering the main surface of the piezoelectric substrate with an air gap on the longitudinal coupling portion, and bumps that are disposed on one of the cover layers and are electrically connected to the longitudinal coupling portion. A mount board is mounted on a motherboard. The SAW filter is mounted on the mount board via the bumps.

Abstract: In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Abstract: A first filter channel with superior attenuation characteristics for transmission signals and is less susceptible to influence of transmission signals inputted to a transmission SAW filter device, is disposed closer to a transmission terminal, whereas a second filter channel with poor attenuation characteristics in a transmission band and is more susceptible to the influence of transmission signals inputted to the transmission SAW filter device, is disposed farther from a transmission terminal to improve isolation characteristics in a differential mode of a duplexer.

Abstract: A high-frequency module includes a multilayer substrate, a filter substrate, a cover layer, a connection electrode, and inductors. The filter substrate includes a first principal surface on which an IDT electrode included in a filter unit is disposed, and the first principal surface faces a mounting surface of the multilayer substrate. The cover layer is spaced apart from and opposite to the first principal surface of the filter substrate. The connection electrode connects the multilayer substrate and the filter substrate. One of the inductors is connected between the filter unit and a first external connection terminal. Another one of the inductors is connected between the filter unit and the ground. The inductors are disposed inside the multilayer substrate. The inductors are inductively coupled to each other.

Abstract: A circuit module and a composite circuit module, which suppress or prevent damage to a connection to or within a device when heat is applied, includes a SAW filter including a piezoelectric substrate. In a package substrate that is a resin substrate, the SAW filter is mounted. A mounting substrate is a multilayer substrate mounted on a mother substrate, and the package substrate is mounted therein.

Abstract: An electronic component includes a support layer that surrounds an element region on a principal surface of a piezoelectric substrate, when viewed in plan from a z-axis direction. A surface acoustic wave element is provided in the element region. A cover layer is provided on the support layer, and is opposed to the principal surface. A pillar member connects the principal surface and the cover layer in a space surrounded by the principal surface, the support layer, and the cover layer, and does not contact with the support layer.

Abstract: In a substrate that improves isolation characteristics of a high-frequency-side signal path and a low-frequency-side signal path, a duplexer, and a substrate module, a package substrate includes two SAW filters mounted thereon and defines a portion of the duplexer. A substrate body includes main surfaces that oppose each other. Land electrodes are provided on one of the main surfaces and are used to connect either of the two SAW filters. Land electrodes are provided on one of the main surfaces and are used to connect a mounting substrate on which the duplexer is mounted and are respectively superposed with the land electrodes when viewed in plan from a z-axis direction. The land electrodes and the land electrodes, which are superposed with each other when viewed in plan from the z-axis direction, are electrically connected to each other.

Abstract: A SAW filter includes a piezoelectric substrate, a longitudinal coupling portion disposed on a main surface of the piezoelectric substrate, a support layer and cover layers covering the main surface of the piezoelectric substrate with an air gap on the longitudinal coupling portion, and bumps that are disposed on one of the cover layers and are electrically connected to the longitudinal coupling portion. A mount board is mounted on a motherboard. The SAW filter is mounted on the mount board via the bumps.