Patents by Inventor SYUN-SIAO CHANG

SYUN-SIAO CHANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of circuit structure
    Patent number: 10314179
    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.
    Type: Grant
    Filed: June 21, 2018
    Date of Patent: June 4, 2019
    Assignee: Unimicron Technology Corp.
    Inventors: Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Cheng-Po Yu, Chi-Min Chang
  • MANUFACTURING METHOD OF CIRCUIT STRUCTURE
    Publication number: 20180302992
    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.
    Type: Application
    Filed: June 21, 2018
    Publication date: October 18, 2018
    Applicant: Unimicron Technology Corp.
    Inventors: Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Cheng-Po Yu, Chi-Min Chang
  • Circuit structure and manufacturing method thereof
    Patent number: 10051748
    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.
    Type: Grant
    Filed: January 18, 2016
    Date of Patent: August 14, 2018
    Assignee: Unimicron Technology Corp.
    Inventors: Hung-Lin Chang, Ming-Hao Wu, Syun-Siao Chang, Cheng-Po Yu, Chi-Min Chang
  • CIRCUIT STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20170164468
    Abstract: A manufacturing method of a circuit board structure is described as follows. An inner circuit structure including a core layer having an upper and an opposite lower surface, a first patterned circuit layer disposed on the upper surface and a second patterned circuit layer disposed on the lower surface is provided. An insulating material layer is formed on a portion of the first patterned circuit layer. A laser resisting layer is formed on at least a portion of the insulating material layer. A release layer is adhered to the laser resisting layer. A build-up process is performed so as to laminate a first and a second build-up circuit structures on the first and the second patterned circuit layers, respectively. A laser ablation process is performed on the first build-up circuit structure so as to form a cavity at least exposing a portion of the upper surface of the core layer.
    Type: Application
    Filed: January 18, 2016
    Publication date: June 8, 2017
    Inventors: HUNG-LIN CHANG, MING-HAO WU, SYUN-SIAO CHANG, CHENG-PO YU, CHI-MIN CHANG