Patents by Inventor Syunichi Nakayama

Syunichi Nakayama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Connector-use contact and production method for component to be soldered
    Patent number: 8294063
    Abstract: In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.
    Type: Grant
    Filed: October 10, 2003
    Date of Patent: October 23, 2012
    Assignee: Panasonic Corporation
    Inventors: Yasunori Miki, Hiroshi Yanagida, Shouichi Nagata, Shin Sato, Yoshiyuki Uchinono, Kenji Jonen, Masaharu Ishikawa, Hiroshi Iwano, Syunichi Nakayama
  • Connector-use contact and production method for component to be soldered
    Publication number: 20050103761
    Abstract: In a contact for a connector, a metal material id processed to be bent in a predetermined shape in a manner so that a terminal portion is formed in the vicinity of an end and a contacting portion is formed in the vicinity of the other end. A nickel plating layer as a foundation plating layer and a gold plating layer are formed on substantially entire surface of the contact including the terminal portion and the contacting portion. Laser beams are irradiated at a portion between the terminal portion and the contacting portion, and especially in the vicinity of the terminal portion so that the nickel plating layer as the foundation plating layer is unsheathed by removing the gold plating layer or gold in the gold plating layer and nickel in the foundation layer are alloyed. Nickel and the alloy of nickel and gold respectively have low wetting property with respect to solder, so that diffusion of melted solder stops at the portion.
    Type: Application
    Filed: October 10, 2003
    Publication date: May 19, 2005
    Inventors: Yasunori Miki, Hiroshi Yanagida, Shouichi Nagata, Shin Sato, Yoshiyuki Uchinono, Kenji Jonen, Masaharu Ishikawa, Hiroshi Iwano, Syunichi Nakayama