Patents by Inventor Syunichi Numata

Syunichi Numata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin
    Patent number: 7538150
    Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.
    Type: Grant
    Filed: September 7, 2005
    Date of Patent: May 26, 2009
    Assignee: Hitachi Chemical Company, Ltd
    Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hikari Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
  • Method for producing benzoxazine resin
    Patent number: 7041772
    Abstract: The present invention discloses a process for producing a benzoxazine resin which comprises the steps of reacting a phenol compound, an aldehyde compound and a primary amine in the presence of an organic solvent to synthesize a benzoxazine resin and removing generated condensation water and the organic solvent from a system under heating and a reduced pressure, wherein a pressure in the reaction system at the time of removal is set to 260 mmHg or higher.
    Type: Grant
    Filed: March 12, 2002
    Date of Patent: May 9, 2006
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Teruki Aizawa, Yasuyuki Hirai, Syunichi Numata
  • Thermosetting resin composition, and prepreg, laminated board for wiring board and printed wiring board using the same
    Publication number: 20060008632
    Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.
    Type: Application
    Filed: September 7, 2005
    Publication date: January 12, 2006
    Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hikari Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi
  • Method for producing benzoxazine resin
    Publication number: 20040138345
    Abstract: The present invention discloses a process for producing a benzoxazine resin which comprises the steps of reacting a phenol compound, an aldehyde compound and a primary amine in the presence of an organic solvent to synthesize a benzoxazine resin and removing generated condensation water and the organic solvent from a system under heating and a reduced pressure, wherein a pressure in the reaction system at the time of removal is set to 260 mmHg or higher.
    Type: Application
    Filed: September 10, 2003
    Publication date: July 15, 2004
    Inventors: Teruki Aizawa, Yasuyuki Hirai, Syunichi Numata
  • Thermosetting resin composition, and prepreg, laminate for circuit board, and printed circuit board each made therewith
    Publication number: 20040076805
    Abstract: The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a dihydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.
    Type: Application
    Filed: July 9, 2003
    Publication date: April 22, 2004
    Inventors: Kenichi Oohori, Yoshihiro Nakamura, Hiraki Murai, Yoshiyuki Takeda, Yasuyuki Hirai, Shinichi Kamoshida, Minoru Kakitani, Norihiro Abe, Syunichi Numata, Teruki Aizawa, Ken Nanaumi