Patents by Inventor Syunji Imamura

Syunji Imamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10388425
    Abstract: To obtain an insulating resin material serving as a material achieving both an excellent low specific dielectric constant and an excellent low linear thermal expansion coefficient, which has heretofore been difficult to obtain, and a metal layer-equipped insulating resin material and a wiring substrate each using the insulating resin material, provided is an insulating resin material, including: porous inorganic aggregates each having pores defined by a plurality of fine particles; and fibrils formed of polytetrafluoroethylene, wherein the fibrils are each multidirectionally oriented, wherein at least one of the porous inorganic aggregates and the fibrils are connected to each other, and wherein the insulating resin material is formed of a micro network structure having a porosity of 50% or more.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: August 20, 2019
    Assignee: NITTO DENKO CORPORATION
    Inventors: Tomoyuki Kasagi, Kou Uemura, Syunji Imamura, Yuya Kitagawa
  • Publication number: 20190074104
    Abstract: To obtain an insulating resin material serving as a material achieving both an excellent low specific dielectric constant and an excellent low linear thermal expansion coefficient, which has heretofore been difficult to obtain, and a metal layer-equipped insulating resin material and a wiring substrate each using the insulating resin material, provided is an insulating resin material, including: porous inorganic aggregates each having pores defined by a plurality of fine particles; and fibrils formed of polytetrafluoroethylene, wherein the fibrils are each multidirectionally oriented, wherein at least one of the porous inorganic aggregates and the fibrils are connected to each other, and wherein the insulating resin material is formed of a micro network structure having a porosity of 50% or more.
    Type: Application
    Filed: March 16, 2017
    Publication date: March 7, 2019
    Applicant: NITTO DENKO CORPORATION
    Inventors: Tomoyuki Kasagi, Kou Uemura, Syunji Imamura, Yuya Kitagawa