Patents by Inventor Syunji Nakazato

Syunji Nakazato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8076054
    Abstract: A composition for forming an adhesive layer which results in strong adhesion force between a substrate and a photosensitive resin layer, and which does not cause transfer of the constituting components to the substrate, a relief printing plate using the same, and a method for manufacturing a relief printing plate are provided. The composition of the present invention comprises (a) a carboxyl group-containing polymer, and (b) an oxazoline group-containing polymer. Adhesive layer 20 formed using the composition of the present invention can be preferably used as an adhesive layer that adheres between substrate 10 and photosensitive resin layer 30 in a relief printing plate.
    Type: Grant
    Filed: February 19, 2007
    Date of Patent: December 13, 2011
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Yoshiaki Katayose, Takaaki Hirai, Syunji Nakazato
  • Patent number: 7402376
    Abstract: A photosensitive resin composition which gives a dry film having a sand blast proof property and a development property in a well-balanced manner. A photosensitive resin composition containing a carboxy group-containing urethane (meth)acrylate compound having two or more of (meth)acryloyl groups per molecule whose acid value of less than 10 mg KOH/g, an alkali soluble polymer compound, a photopolymerization initiator and a photopolymerizable compound (D) including in the structure thereof a structural unit represented by the formula (I) gives such a well-balanced properties.
    Type: Grant
    Filed: April 5, 2005
    Date of Patent: July 22, 2008
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Syunji Nakazato, Ryuma Mizusawa, Hiroyuki Obiya, Takashi Ono, Yusuke Fujito
  • Publication number: 20070243486
    Abstract: A composition for forming an adhesive layer which results in strong adhesion force between a substrate and a photosensitive resin layer, and which does not cause transfer of the constituting components to the substrate, a relief printing plate using the same, and a method for manufacturing a relief printing plate are provided. The composition of the present invention comprises (a) a carboxyl group-containing polymer, and (b) an oxazoline group-containing polymer. Adhesive layer 20 formed using the composition of the present invention can be preferably used as an adhesive layer that adheres between substrate 10 and photosensitive resin layer 30 in a relief printing plate.
    Type: Application
    Filed: February 19, 2007
    Publication date: October 18, 2007
    Applicant: TOKYO OHKA KOGYO CO., LTD.
    Inventors: Yoshiaki Katayose, Takaaki Hirai, Syunji Nakazato
  • Publication number: 20050238998
    Abstract: A photosensitive resin composition which gives a dry film having a sand blast proof property and a development property in a well-balanced manner. A photosensitive resin composition containing a carboxy group-containing urethane (meth)acrylate compound having two or more of (meth)acryloyl groups per molecule whose acid value of less than 10 mg KOH/g, an alkali soluble polymer compound, a photopolymerization initiator and a photopolymerizable compound (D) including in the structure thereof a structural unit represented by the formula (I) gives such a well-balanced properties.
    Type: Application
    Filed: April 5, 2005
    Publication date: October 27, 2005
    Inventors: Syunji Nakazato, Ryuma Mizusawa, Hiroyuki Obiya, Takashi Ono, Yusuke Fujito
  • Patent number: 6897011
    Abstract: A photosensitive composition for sandblasting comprising the components of: (A) a photopolymerizable urethane (meth)acrylate oligomer comprising (meth)acryloyl group; (B) an acrylic copolymer; and (C) a photopolymerization initiator, wherein the component (B) comprises, as a monomer unit, one of copolymerizable monomers comprising one of a benzene ring and a cyclohexyl group.
    Type: Grant
    Filed: March 16, 2004
    Date of Patent: May 24, 2005
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Akira Kumazawa, Ryuma Mizusawa, Syunji Nakazato, Hiroyuki Obiya
  • Publication number: 20040175659
    Abstract: A photosensitive composition for sandblasting comprising the components of: (A) a photopolymerizable urethane (meth)acrylate oligomer comprising (meth)acryloyl group; (B) an acrylic copolymer; and (C) a photopolymerization initiator, wherein the component (B) comprises, as a monomer unit, one of copolymerizable monomers comprising one of a benzene ring and a cyclohexyl group.
    Type: Application
    Filed: March 16, 2004
    Publication date: September 9, 2004
    Applicant: Tokyo Ohka Kogyo Co., Ltd., a Japan corporation
    Inventors: Akira Kumazawa, Ryuma Mizusawa, Syunji Nakazato, Hiroyuki Obiya
  • Publication number: 20030059543
    Abstract: An insulating paste composition for rib formation which comprises an insulating material, an organic binder, a light-absorbing substance, and an organic solvent. A rib pattern is formed by sandblasting an insulating layer formed of the composition using a lithographically formed resin pattern mask. The composition forms an antireflective insulating layer which can provide a rib pattern excellent in cross-sectional contour and dimensional precision.
    Type: Application
    Filed: March 8, 2002
    Publication date: March 27, 2003
    Applicant: Tokyo Ohka Kogyo Co., Ltd., a Japan corporation
    Inventors: Syunji Nakazato, Hiromitsu Sato, Hiroyuki Obiya, Hiroyuki Nishimura
  • Publication number: 20020076652
    Abstract: A photosensitive composition for sandblasting comprising the components of: (A) a photopolymerizable urethane (meth)acrylate oligomer comprising (meth)acryloyl group; (B) an acrylic copolymer; and (C) a photopolymerization initiator, wherein the component (B) comprises, as a monomer unit, one of copolymerizable monomers comprising one of a benzene ring and a cyclohexyl group.
    Type: Application
    Filed: November 6, 2001
    Publication date: June 20, 2002
    Inventors: Akira Kumazawa, Ryuma Mizusawa, Syunji Nakazato, Hiroyuki Obiya
  • Patent number: 6372292
    Abstract: An insulating paste composition for rib formation which comprises an insulating material, an organic binder, a light-absorbing substance, and an organic solvent. A rib pattern is formed by sandblasting an insulating layer formed of the composition using a lithographically formed resin pattern mask. The composition forms an antireflective insulating layer which can provide a rib pattern excellent in crosssectional contour and dimensional precision.
    Type: Grant
    Filed: March 16, 2000
    Date of Patent: April 16, 2002
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Syunji Nakazato, Hiromitsu Sato, Hiroyuki Obiya, Hiroyuki Nishimura
  • Patent number: 6200733
    Abstract: A photosensitive composition for sandblasting and a photosensitive film having a photosensitive layer comprising the photosensitive composition are disclosed, the photosensitive composition comprising a photopolymerizable urethane (meth)acrylate oligomer having at least two acryloyl groups and/or methacryloyl groups, a photopolymerization initiator, and at least one cellulose derivative selected from the group consisting of hydroxypropyl cellulose, ethylhydroxyethyl cellulose, hydroxypropylmethyl cellulose phthalate, and hydroxypropylmethyl cellulose acetate phthalate. The composition exhibits excellent adhesion to a substrate, high sensitivity, and high resistance to sandblasting.
    Type: Grant
    Filed: October 14, 1998
    Date of Patent: March 13, 2001
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Ryuma Mizusawa, Syunji Nakazato, Hiroyuki Obiya