Patents by Inventor Syunji Onobori

Syunji Onobori has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
    Patent number: 7938929
    Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
    Type: Grant
    Filed: January 8, 2009
    Date of Patent: May 10, 2011
    Assignee: Panasonic Corporation
    Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino
  • HEATING AND PRESSURIZING APPARATUS FOR USE IN MOUNTING ELECTRONIC COMPONENTS, AND APPARATUS AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS
    Publication number: 20090120998
    Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
    Type: Application
    Filed: January 8, 2009
    Publication date: May 14, 2009
    Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino
  • Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
    Patent number: 7490652
    Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
    Type: Grant
    Filed: September 27, 2005
    Date of Patent: February 17, 2009
    Assignee: Panasonic Corporation
    Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino
  • Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
    Publication number: 20060016562
    Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
    Type: Application
    Filed: September 27, 2005
    Publication date: January 26, 2006
    Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino
  • Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
    Publication number: 20030121616
    Abstract: A beating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
    Type: Application
    Filed: February 13, 2003
    Publication date: July 3, 2003
    Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino
  • Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components
    Patent number: 6544377
    Abstract: A heating and pressurizing apparatus (101), to which a circuit board (70) with electronic components (8) pre-bonded thereto via bonding elements (9) is carried in, is provided. The heating and pressurizing apparatus post-bonds the electronic component to the circuit board by heating and pressurizing the electronic component by a contact member (1211) having a heating device (122). By executing the pre-bonding and the post-bonding of the electronic components to the circuit board independently of each other, the time required for the post-bonding can be reduced, compared with the conventional case, and the productivity of the whole mounting line can be improved.
    Type: Grant
    Filed: May 18, 2000
    Date of Patent: April 8, 2003
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino