Patents by Inventor Syunso Yoshida

Syunso Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer processing system
    Patent number: 5950643
    Abstract: A processing system for processing of wafers that are formed by slicing a cylindrical workpiece which is adhered to a support plate by an adhesive agent. The processing system includes a washing apparatus, a removing apparatus, a separating apparatus, and a transferring apparatus. The washing apparatus washes the wafers that are remained adhered to the support plate. The removing apparatus removes a group of the wafers from the support plate. The removed wafers are gathered in a cylindrical shape. The separating apparatus separates the wafers one by one. The separating apparatus includes a vessel for accommodating the wafers separated one from another. The transferring apparatus transfers the wafers from the washing apparatus to the removing apparatus and then to the separating apparatus.
    Type: Grant
    Filed: September 4, 1996
    Date of Patent: September 14, 1999
    Inventors: Takeshiro Miyazaki, Yoshikazu Tsubata, Akio Kawakita, Noboru Katsumata, Akihiro Nakayama, Toyokazu Harada, Mitsuo Takaku, Syunso Yoshida