Patents by Inventor Syunsuke Ishikawa

Syunsuke Ishikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Flux for soldering, soldering method, and printed circuit board
    Patent number: 7798389
    Abstract: A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.
    Type: Grant
    Filed: March 23, 2007
    Date of Patent: September 21, 2010
    Assignee: Harima Chemicals, Inc.
    Inventors: Kazuki Ikeda, Hisao Irie, Toshinori Shima, Takaaki Anada, Syunsuke Ishikawa
  • Flux for soldering, soldering method, and printed circuit board
    Publication number: 20070186997
    Abstract: A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.
    Type: Application
    Filed: March 23, 2007
    Publication date: August 16, 2007
    Inventors: Kazuki Ikeda, Hisao Irie, Toshinori Shima, Takaaki Anada, Syunsuke Ishikawa
  • Flux for soldering, soldering method, and printed circuit board
    Publication number: 20060043157
    Abstract: A flux for soldering used when soldering is performed to a board subjected to electroless nickel plating, the flux containing resin having film forming ability, activator, and solvent, and further containing metallic salt in an amount of 0.1 to 20% by weight of the total amount of flux. The use of this flux suppresses diffusion of nickel solder in soldering portions, and prevents concentration of phosphorous, thereby improving the bonding strength of soldering.
    Type: Application
    Filed: August 25, 2004
    Publication date: March 2, 2006
    Inventors: Kazuki Ikeda, Hisao Irie, Toshinori Shima, Takaaki Anada, Syunsuke Ishikawa