Patents by Inventor Syunsuke Takeuchi
Syunsuke Takeuchi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11158459Abstract: A ceramic electronic component includes a ceramic body having first and second end surfaces facing each other, first and second side surfaces facing each other, first and second principal surfaces facing each other, and also includes outer electrodes each of which is provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body. Each of the outer electrodes includes an underlying electrode layer provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body and also includes a plating layer provided on a corresponding one of the underlying electrode layers and on a corresponding one of regions different from the underlying electrode layers.Type: GrantFiled: November 8, 2019Date of Patent: October 26, 2021Assignee: MURATA MANUFACTURING COMPANY, LTD.Inventors: Syunsuke Takeuchi, Yusuke Arakawa, Masaki Tsutsumi
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Publication number: 20200152387Abstract: A ceramic electronic component includes a ceramic body having first and second end surfaces facing each other, first and second side surfaces facing each other, first and second principal surfaces facing each other, and also includes outer electrodes each of which is provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body. Each of the outer electrodes includes an underlying electrode layer provided on at least one portion of a corresponding one of the first and second end surfaces of the ceramic body and also includes a plating layer provided on a corresponding one of the underlying electrode layers and on a corresponding one of regions different from the underlying electrode layers.Type: ApplicationFiled: November 8, 2019Publication date: May 14, 2020Inventors: Syunsuke TAKEUCHI, Yusuke ARAKAWA, Masaki TSUTSUMI
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Patent number: 9536669Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.Type: GrantFiled: July 22, 2015Date of Patent: January 3, 2017Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Syunsuke Takeuchi, Makoto Ogawa, Seiichi Nishihara, Kenichi Kawasaki, Shuji Matsumoto
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Patent number: 9343230Abstract: In an electronic component, a body includes top and bottom surfaces, first and second end surfaces, and first and second lateral surfaces. A first outer electrode partially extends over the bottom surface and the first end surface without being disposed on the top surface, the second end surface, and both the lateral surfaces. A second outer electrode partially extends over the bottom surface and the second end surface without being disposed on the top surface, the first end surface, and both the lateral surfaces. An area of a first end surface portion of the first outer electrode disposed on the first end surface and area of a second end surface portion of the second outer electrode disposed on the second end surface are in a range of about 6.6% to about 35.0% of area of the first and second end surfaces, respectively.Type: GrantFiled: April 19, 2013Date of Patent: May 17, 2016Assignee: Murata Manufacturing Co., Ltd.Inventors: Syunsuke Takeuchi, Yutaka Ota
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Publication number: 20150325374Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.Type: ApplicationFiled: July 22, 2015Publication date: November 12, 2015Inventors: Akihiro MOTOKI, Syunsuke TAKEUCHI, Makoto OGAWA, Seiichi NISHIHARA, Kenichi KAWASAKI, Shuji MATSUMOTO
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Patent number: 9123469Abstract: In a method of forming a plating layer for an external terminal electrode by applying, for example, copper plating to an end surface of a component main body with respective ends of internal electrodes exposed, and then applying a heat treatment at a temperature of about 1000° C. or more in order to improve the adhesion strength and moisture resistance of the external terminal electrode, the plating layer may be partially melted to decrease the bonding strength of the plating layer. In the step of applying a heat treatment at a temperature of about 1000° C. or more to a component main body with plating layers formed thereon, the average rate of temperature increase from room temperature to the temperature of about 1000° C. or more is set to about 100° C./minute or more. This average rate of temperature increase maintains a moderate eutectic state in the plating layer and ensures a sufficient bonding strength of the plating layer.Type: GrantFiled: March 18, 2011Date of Patent: September 1, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Syunsuke Takeuchi, Makoto Ogawa, Seiichi Nishihara, Kenichi Kawasaki, Shuji Matsumoto
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Patent number: 9013859Abstract: A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.Type: GrantFiled: February 4, 2011Date of Patent: April 21, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Masahito Saruban, Makoto Ogawa, Akihiro Motoki, Syunsuke Takeuchi, Kiyoyasu Sakurada
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Patent number: 8971015Abstract: An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 ?m or more.Type: GrantFiled: May 22, 2013Date of Patent: March 3, 2015Assignee: Murata Manufacturing Co., Ltd.Inventors: Syunsuke Takeuchi, Yoji Yamamoto, Akihiro Motoki, Makoto Ogawa, Masahito Saruban
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Patent number: 8717739Abstract: A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.Type: GrantFiled: March 14, 2012Date of Patent: May 6, 2014Assignee: Murata Manufacturing Co., Ltd.Inventors: Yoji Yamamoto, Akihiro Motoki, Syunsuke Takeuchi, Makoto Ogawa, Toshiyuki Iwanaga
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Publication number: 20130294009Abstract: In an electronic component, a body includes top and bottom surfaces, first and second end surfaces, and first and second lateral surfaces. A first outer electrode partially extends over the bottom surface and the first end surface without being disposed on the top surface, the second end surface, and both the lateral surfaces. A second outer electrode partially extends over the bottom surface and the second end surface without being disposed on the top surface, the first end surface, and both the lateral surfaces. An area of a first end surface portion of the first outer electrode disposed on the first end surface and area of a second end surface portion of the second outer electrode disposed on the second end surface are in a range of about 6.6% to about 35.0% of area of the first and second end surfaces, respectively.Type: ApplicationFiled: April 19, 2013Publication date: November 7, 2013Applicant: Murata Manufacturing Co., Ltd.Inventors: Syunsuke TAKEUCHI, Yutaka OTA
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Patent number: 8553391Abstract: In an electronic component, a laminate includes a plurality of laminated ceramic layers and a mounting surface defined by outer edges of the plurality of laminated ceramic layers, the outer edges being continuously located adjacent to each other. Capacitor conductors are disposed on the ceramic layers and include exposed portions that are exposed at the mounting surface between the ceramic layers. An electroconductive layer defining an external electrode is arranged to directly cover the exposed portions and is formed by plating so as to be made of plated material. Another electroconductive layer covers the above-mentioned electroconductive layer and partially covers surfaces of the laminate, and it is made of a material including metal and one of glass and resin.Type: GrantFiled: September 15, 2011Date of Patent: October 8, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Syunsuke Takeuchi, Kiyoyasu Sakurada
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Publication number: 20130250474Abstract: An electronic component includes a laminate including a plurality of insulating layers that are laminated on each other. A capacitor conductor is embedded in the laminate and includes an exposed portion exposed between the insulating layers at a predetermined surface of the laminate. An external electrode is provided on the predetermined surface by direct plating so as to cover the exposed portion. An outer edge of the external electrode is spaced away from the exposed portion by about 0.8 ?m or more.Type: ApplicationFiled: May 22, 2013Publication date: September 26, 2013Applicant: Murata Manufacturing Co., Ltd.Inventors: Syunsuke TAKEUCHI, Yoji YAMAMOTO, Akihiro MOTOKI, Makoto OGAWA, Masahito SARUBAN
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Patent number: 8520361Abstract: A laminated electronic component includes a first plating film that defines a base for external terminal electrodes and that includes a plurality of layers including a first layer made of, for example, copper and a second layer provided on the first layer. The total thickness of the first plating film is about 3 ?m to about 15 ?m, and the thickness of the second layer is about 2 to 10 times as thick as the thickness of the first layer. The first layer is formed by electroless plating, and the second layer is formed by electrolytic plating. This formation results in a grain size of about 0.5 ?m or more of a metal grain included in the second layer, and thus makes the film less susceptible to oxidation.Type: GrantFiled: March 11, 2011Date of Patent: August 27, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Akihiro Motoki, Syunsuke Takeuchi, Makoto Ogawa, Kenichi Kawasaki
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Patent number: 8508913Abstract: In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.Type: GrantFiled: December 27, 2011Date of Patent: August 13, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Masahito Saruban, Makoto Ogawa, Wataru Ogawa, Akihiro Motoki, Syunsuke Takeuchi, Yoji Yamamoto
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Patent number: 8411409Abstract: When an external terminal electrode of a ceramic electronic component such as a laminated ceramic capacitor is formed by plating, plating growth may be also caused even in an undesired location. The ceramic surface provided by a component main body is configured to include a high plating growth region of, for example, a barium titanate based ceramic, which exhibits relatively high plating growth, and a low plating growth region of, for example, a calcium zirconate based ceramic, which exhibits relatively low plating growth. The plating film constituting a first layer to define a base for an external terminal electrode is formed in such a way that the growth of a plated deposit deposited with conductive surfaces provided by exposed ends of internal electrodes as starting points is limited so as not to cross over a boundary between the high plating growth region and the low plating growth region toward the low plating growth region.Type: GrantFiled: June 16, 2011Date of Patent: April 2, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Masahito Saruban, Toshiyuki Iwanaga, Syunsuke Takeuchi, Kiyoyasu Sakurada
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Patent number: 8355241Abstract: A laminated electronic component includes a component body including a plurality of laminated functional layers, a plurality of internal conductors provided inside the component body, and an external terminal electrode that is electrically connected to an internal conductor via an exposed portion of the internal conductor and that is defined by a direct plating film. An average grain diameter of metal grains defining the plating film is about 0.1 ?m or less.Type: GrantFiled: November 10, 2010Date of Patent: January 15, 2013Assignee: Murata Manufacturing Co., Ltd.Inventors: Makoto Ogawa, Akihiro Motoki, Syunsuke Takeuchi, Kenichi Kawasaki
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Patent number: 8334748Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.Type: GrantFiled: January 25, 2012Date of Patent: December 18, 2012Assignee: Murata Manufacturing Co., Ltd.Inventors: Syunsuke Takeuchi, Teruyo Katayama, Toshiyuki Iwanaga, Akihiro Motoki, Makoto Ogawa, Kenichi Kawasaki
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Publication number: 20120236461Abstract: A ceramic electronic component includes a substantially rectangular ceramic element assembly, a first external electrode, and a second external electrode. The first external electrode includes at least one plating film including a first plating film disposed directly on the ceramic element assembly from outside. Likewise, the second external electrode includes at least one plating film including a second plating film disposed directly on the ceramic element assembly from outside. The first and second plating films each have a surface area per unit area equal to or larger than about 1.02 in plan view.Type: ApplicationFiled: March 14, 2012Publication date: September 20, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Yoji YAMAMOTO, Akihiro MOTOKI, Syunsuke TAKEUCHI, Makoto OGAWA, Toshiyuki IWANAGA
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Publication number: 20120188683Abstract: A method for manufacturing a ceramic electronic component includes the steps of preparing a ceramic body including a plurality of first internal electrodes and a plurality of second internal electrodes, processing the ceramic body to an internal electrode exposure rate of about 102% to about 153%, and plating the processed ceramic body to form a plated layer thereon.Type: ApplicationFiled: January 25, 2012Publication date: July 26, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Syunsuke TAKEUCHI, Teruyo KATAYAMA, Toshiyuki IWANAGA, Akihiro MOTOKI, Makoto OGAWA, Kenichi KAWASAKI
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Publication number: 20120169180Abstract: In a method of manufacturing a laminate type electronic component, when a heat treatment is carried out after plating films, which at least partially define external electrodes, are formed by growing plated depositions deposited on exposed ends of a plurality of internal electrodes in a component main body, the presence of the plating films may not only interfere with moisture release, but may also cause blisters or bulge defects in the plating films, while moisture such as a plating solution in the component main body is removed by evaporation. To avoid such problems, cuts to divide exposed ends into multiple sections are formed in extending sections of internal electrodes. Thus, plating films include slits extending in the stacking direction at locations corresponding to positions of the cuts.Type: ApplicationFiled: December 27, 2011Publication date: July 5, 2012Applicant: MURATA MANUFACTURING CO., LTD.Inventors: Masahito SARUBAN, Makoto OGAWA, Wataru OGAWA, Akihiro MOTOKI, Syunsuke TAKEUCHI, Yoji YAMAMOTO