Patents by Inventor Syunsuke UCHIDA

Syunsuke UCHIDA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Thermally conductive sheet, method for producing same, and semiconductor device
    Patent number: 9966324
    Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 ?m to 250 ?m, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 ?m or less.
    Type: Grant
    Filed: June 18, 2014
    Date of Patent: May 8, 2018
    Assignee: DEXERIALS CORPORATION
    Inventors: Keisuke Aramaki, Atsuya Yoshinari, Takuhiro Ishii, Shin-ichi Uchida, Masahiko Ito, Syunsuke Uchida
  • Thermally conductive sheet
    Patent number: 9437521
    Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.
    Type: Grant
    Filed: January 6, 2016
    Date of Patent: September 6, 2016
    Assignee: DEXERIALS CORPORATION
    Inventors: Keisuke Aramaki, Takuhiro Ishii, Masahiko Ito, Shinichi Uchida, Atsuya Yoshinari, Syunsuke Uchida
  • THERMALLY CONDUCTIVE SHEET
    Publication number: 20160118316
    Abstract: A thermally conductive sheet, comprising a curable resin composition, thermally conductive fibers, and thermally conductive particles, wherein the thermally conductive sheet has a compressibility of 40% or more.
    Type: Application
    Filed: January 6, 2016
    Publication date: April 28, 2016
    Inventors: Keisuke Aramaki, Takuhiro Ishii, Masahiko Ito, Shinichi Uchida, Atsuya Yoshinari, Syunsuke Uchida
  • Thermally Conductive Sheet, Method for Producing Same, and Semiconductor Device
    Publication number: 20160104657
    Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 ?m to 250 ?m, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 ?m or less.
    Type: Application
    Filed: June 18, 2014
    Publication date: April 14, 2016
    Inventors: Keisuke ARAMAKI, Atsuya YOSHINARI, Takuhiro ISHII, Shin-ichi UCHIDA, Masahiko ITO, Syunsuke UCHIDA