Abstract: A photodetection device according to an embodiment includes a plurality of pixels arranged in a matrix, in which each of the pixels includes a semiconductor substrate having a first surface and a second surface opposed to each other, a first photoelectric conversion portion disposed on the second surface side of the semiconductor substrate, an insulating layer covering the first surface of the semiconductor substrate, and at least one pixel transistor located on the first surface side of the semiconductor substrate with the insulating layer interposed therebetween.

Abstract: A highly functional photoelectric conversion element is provided.

Abstract: Light reduction in a wiring part connected to an optical device of an electronic device including the optical device is prevented. The electronic device includes an insulating layer, an interlayer connection wiring, and an upper layer wiring. The insulating layer is disposed adjacent to the lower layer wiring and includes a through hole. The interlayer connection wiring is a transparent wiring that is connected to the lower layer wiring in the through hole and is formed into a shape extending to a surface side of the insulating layer. The upper layer wiring is a transparent wiring that is stacked and connected to the interlayer connection wiring extending to the surface side of the insulating layer.