Patents by Inventor Syuuichi ANDOU

Syuuichi ANDOU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wafer holding apparatus and baseplate structure
    Patent number: 10847401
    Abstract: A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a water pathway disposed inside the water pathway portion and having an entire wall surface thereof constituted by the water pathway portion, wherein the baseplate and the water pathway portion are directly bonded to each other.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: November 24, 2020
    Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., TOHOKU SEIMITSU CO., LTD.
    Inventors: Norio Shiraiwa, Syuuichi Andou, Kenji Takatsuka, Katsuhiro Kosuga
  • WAFER HOLDING APPARATUS AND BASEPLATE STRUCTURE
    Publication number: 20170372934
    Abstract: A wafer holding apparatus includes an electrostatic chuck configured to clamp an object, a baseplate made of aluminum and configured to support the electrostatic chuck, a water pathway portion disposed in contact with or inside the baseplate and made of a metal having higher corrosion resistance than aluminum, and a water pathway disposed inside the water pathway portion and having an entire wall surface thereof constituted by the water pathway portion, wherein the baseplate and the water pathway portion are directly bonded to each other.
    Type: Application
    Filed: June 12, 2017
    Publication date: December 28, 2017
    Inventors: Norio SHIRAIWA, Syuuichi ANDOU, Kenji TAKATSUKA, Katsuhiro KOSUGA