Patents by Inventor Syuzi Ueda

Syuzi Ueda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6319475
    Abstract: Conventional container is composed of a single resin layer. In case of applying heat externally to the container, the heat is hardly conducted. According to the present invention, a container with high thermal conductivity can be provided. A portion contacted with a sample is composed of a resin alone, a portion contacted with a sample container supporter is composed of two portions of a flexible resin mixed a filler having high thermal conductivity therein and a resin and a filler having high thermal conductivity. The present invention is applicable to biotechnological, chemical, medical and engineering fields to develop new uses and applications.
    Type: Grant
    Filed: September 26, 1997
    Date of Patent: November 20, 2001
    Inventors: Keiichi Katoh, Syuzi Ueda