Patents by Inventor Syuzo Aoki
Syuzo Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9933822Abstract: An electronic component case includes, a lower case including a bottom plate, a side wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole formed in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.Type: GrantFiled: March 29, 2016Date of Patent: April 3, 2018Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Minshong Tan, Syuzo Aoki, Takuya Oda
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Patent number: 9920232Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.Type: GrantFiled: July 6, 2015Date of Patent: March 20, 2018Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., NAGANO PREFECTUREInventors: Syuzo Aoki, Takuya Oda, Takuya Kurosawa, Shoji Koizumi, Hidekazu Takizawa, Yutaka Komatsu, Shinichi Anzawa
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Patent number: 9476138Abstract: In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.Type: GrantFiled: February 23, 2012Date of Patent: October 25, 2016Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD, SHINSHU UNIVERSITYInventors: Yoriyuki Suwa, Kenji Kawamura, Syuzo Aoki, Masao Nakazawa, Susumu Arai
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Publication number: 20160209888Abstract: An electronic component case includes, a lower case including a bottom plate, a side wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole formed in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.Type: ApplicationFiled: March 29, 2016Publication date: July 21, 2016Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Minshong TAN, Syuzo AOKI, Takuya ODA
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Patent number: 9332659Abstract: An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.Type: GrantFiled: September 4, 2014Date of Patent: May 3, 2016Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Minshong Tan, Syuzo Aoki, Takuya Oda
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Publication number: 20150307765Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.Type: ApplicationFiled: July 6, 2015Publication date: October 29, 2015Inventors: Syuzo AOKI, Takuya ODA, Takuya KUROSAWA, Shoji KOIZUMI, Hidekazu TAKIZAWA, Yutaka KOMATSU, Shinichi ANZAWA
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Patent number: 9136200Abstract: A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.Type: GrantFiled: September 9, 2011Date of Patent: September 15, 2015Assignee: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoriyuki Suwa, Kenji Kawamura, Syuzo Aoki, Masao Nakazawa
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Patent number: 9101981Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.Type: GrantFiled: December 9, 2011Date of Patent: August 11, 2015Assignees: SHINKO ELECTRIC INDUSTRIES CO., LTD., NAGANO PREFECTUREInventors: Syuzo Aoki, Takuya Oda, Takuya Kurosawa, Shoji Koizumi, Hidekazu Takizawa, Yutaka Komatsu, Shinichi Anzawa
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Publication number: 20150092337Abstract: An electronic component case includes a lower case including a bottom plate, a aide wall having a protruding portion, an engaging projection formed on an outer face of the side wall, and a screw hole formed in the side wall in a region where the protruding portion is provided, and an upper case including a top plate, a side wall in which an engaging hole is formed, and a notched hole forced in the side wall on the top plate side. The protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole. The engaging projection of the lower case is engaged in the engaging hole of the upper case.Type: ApplicationFiled: September 4, 2014Publication date: April 2, 2015Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Minshong TAN, Syuzo AOKI, Takuya ODA
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Publication number: 20140034282Abstract: A heat radiation component includes a substrate including a predetermined surface, a plurality of carbon materials arranged with spaces in between, and a plating layer having a surface and including a plating material that fills the spaces between the plurality of carbon materials. At least one of the plurality of carbon materials is oriented orthogonal to the predetermined surface of the substrate. A part of each of the plurality of carbon materials protrudes from the surface of the plating layer in a direction opposite to the substrate.Type: ApplicationFiled: July 26, 2013Publication date: February 6, 2014Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kenji KAWAMURA, Syuzo AOKI, Masao NAKAZAWA, Yoriyuki SUWA
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Publication number: 20120216997Abstract: In one embodiment, there is provided a composite plating liquid. The composite plating liquid includes: a plating metal salt; a sulfate of at least one element selected from alkali metals and alkaline earth metals; boric acid; a carbon nanotube; and a dispersant. Also, there is provided a plating method of plating a member using the composite plating liquid, and a composite plating film formed by the plating method.Type: ApplicationFiled: February 23, 2012Publication date: August 30, 2012Applicants: SHINSHU UNIVERSITY, SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoriyuki Suwa, Kenji Kawamura, Syuzo Aoki, Masao Nakazawa, Susumu Arai
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Publication number: 20120189839Abstract: A method of manufacturing a metal composite material includes applying a mechanical impact force to a carbon material and a metal powder at such an intensity as capable of pulverizing the carbon material, thereby adhering the carbon material to a surface of the metal powder.Type: ApplicationFiled: December 9, 2011Publication date: July 26, 2012Applicants: Nagano Prefecture, Shinko Electric Industries Co., Ltd.Inventors: Syuzo AOKI, Takuya Oda, Takuya Kurosawa, Shoji Koizumi, Hidekazu Takizawa, Yutaka Komatsu, Shinichi Anzawa
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Patent number: 8213182Abstract: A housing case housing an electronic circuit board, includes: a lower case portion which internally houses a circuit board for mounting electronic components; and an upper case portion which is externally fitted to the lower case portion to form a box-like member. Each of the lower case portion and the upper case portion includes a planar portion, and sidewall portions which stand from the peripheral edge of the planar portion. The planar portion and the sidewall portions are formed by using a plate-like member made of a metal material. Engaging projections which are outwardly projected are disposed on the sidewall portions of the lower case portion. Engaging holes which are passed through the sidewall portions of the upper case portion are disposed in the sidewall portions, in positions corresponding to the engaging projections of the lower case portion.Type: GrantFiled: November 12, 2009Date of Patent: July 3, 2012Assignee: Shinko Electric Industries Co., Ltd.Inventors: Syuzo Aoki, Meisou Chin
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Publication number: 20120064361Abstract: A heat radiating component includes a base including a first metal, a first plating layer formed on the base and including a second metal and carbon material structures dispersed in the second metal, and a second plating layer formed on the first plating layer. The first plating layer includes protruding parts that are parts of the carbon material structures protruding from a surface of the second metal. The second plating layer is formed on the first plating layer to cover surfaces of the protruding parts and the surface of the second metal without filling spaces between the protruding parts.Type: ApplicationFiled: September 9, 2011Publication date: March 15, 2012Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Yoriyuki SUWA, Kenji Kawamura, Syuzo Aoki, Masao Nakazawa
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Publication number: 20110127013Abstract: A heat-radiating component includes a wick layer formed on an inner wall of a hermetically sealed container made of metal and a working fluid encapsulated in the hermetically sealed container. In the wick layer, micro carbon fiber is mixed into metal powder. In one aspect, the wick layer is a structure combined by a first wick and a second wick, the first wick being formed of sintered metal powder, and the second wick being a plating layer into which micro carbon fiber is mixed so as to partially fill air space inside the first wick while covering a surface of the first wick. The first wick is preferably a body sintered copper powder, and the second wick is preferably made of a copper plating layer into which carbon nanotube or carbon nanofiber is mixed.Type: ApplicationFiled: November 22, 2010Publication date: June 2, 2011Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Kenji KAWAMURA, Syuzo Aoki, Atsushi Shimazaki
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Publication number: 20100265675Abstract: A housing case housing an electronic circuit board, includes: a lower case portion which internally houses a circuit board for mounting electronic components; and an upper case portion which is externally fitted to the lower case portion to form a box-like member. Each of the lower case portion and the upper case portion includes a planar portion, and sidewall portions which stand from the peripheral edge of the planar portion. The planar portion and the sidewall portions are formed by using a plate-like member made of a metal material. Engaging projections which are outwardly projected are disposed on the sidewall portions of the lower case portion. Engaging holes which are passed through the sidewall portions of the upper case portion are disposed in the sidewall portions, in positions corresponding to the engaging projections of the lower case portion.Type: ApplicationFiled: November 12, 2009Publication date: October 21, 2010Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Syuzo Aoki, Meisou Chin
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Patent number: 7483273Abstract: In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.Type: GrantFiled: May 26, 2006Date of Patent: January 27, 2009Assignee: Shinko Electric Industries Co., Ltd.Inventors: Sumio Uehara, Syuzo Aoki
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Publication number: 20060268524Abstract: In a semiconductor module 10 in which a semiconductor device 17 is mounted on both surfaces of a circuit board 11 and heat radiation plates 12a, 12b are provided to both surfaces of the circuit board to cover the semiconductor device, a fitting hole via which the heat radiation plates 12a, 12b are fitted is formed in the circuit board 11, and a housing recess portion 18 in which the semiconductor devices 11 are housed is provided to both heat radiation plates 12a, 12b fitted to both surfaces of the circuit board 11 respectively and a fitting edge portion 25 is provided in a position of both heat radiation plates that overlaps with a position in which the fitting hole is formed, and also a fixing means 20 for fixing both heat radiation plates 12a, 12b to the circuit board 11 by caulking to align with the fitting hole is provided to fitting edge portions 25 integrally with the heat radiation plates 12a, 12b.Type: ApplicationFiled: May 26, 2006Publication date: November 30, 2006Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Sumio Uehara, Syuzo Aoki