Patents by Inventor Sz-Shian Wu

Sz-Shian Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of heat dissipation component
    Patent number: 11183442
    Abstract: The invention provides a manufacturing method of a heat dissipation component. A substrate is provided. The substrate has an outer surface. A patterned dry film is formed on the outer surface. The patterned dry film is composed of a plurality of microporous patterns. A thermally conductive layer is formed on a region excluding the microporous patterns on the outer surface. The patterned dry film is removed to form a plurality of micro meshes. The thermally conductive layer surrounds the micro meshes.
    Type: Grant
    Filed: August 27, 2019
    Date of Patent: November 23, 2021
    Assignee: COMPEQ MANUFACTURING CO., LTD.
    Inventors: Sz-Shian Wu, Hung-Yi Lee
  • MANUFACTURING METHOD OF HEAT DISSIPATION COMPONENT
    Publication number: 20210005530
    Abstract: The invention provides a manufacturing method of a heat dissipation component. A substrate is provided. The substrate has an outer surface. A patterned dry film is formed on the outer surface. The patterned dry film is composed of a plurality of microporous patterns. A thermally conductive layer is formed on a region excluding the microporous patterns on the outer surface. The patterned dry film is removed to form a plurality of micro meshes. The thermally conductive layer surrounds the micro meshes.
    Type: Application
    Filed: August 27, 2019
    Publication date: January 7, 2021
    Applicant: COMPEQ MANUFACTURING CO., LTD.
    Inventors: Sz-Shian Wu, Hung-Yi Lee