Patents by Inventor Sze Min Wong

Sze Min Wong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit package system with multi-planar paddle
    Patent number: 8138586
    Abstract: An integrated circuit package system includes a multi-planar paddle having an uplift rim and an attached integrated circuit over the uplift rim of the multi-planar paddle.
    Type: Grant
    Filed: May 4, 2006
    Date of Patent: March 20, 2012
    Assignee: Stats Chippac Ltd.
    Inventors: Arnel Trasporto, Sze Min Wong, Henry D. Bathan, Zigmund Ramirez Camacho
  • INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTI-PLANAR PADDLE
    Publication number: 20070108566
    Abstract: An integrated circuit package system includes a multi-planar paddle having an uplift rim and an attached integrated circuit over the uplift rim of the multi-planar paddle.
    Type: Application
    Filed: May 4, 2006
    Publication date: May 17, 2007
    Applicant: STATS ChipPAC Ltd.
    Inventors: Arnel Trasporto, Sze Min Wong, Henry Bathan, Zigmund Camacho