Patents by Inventor Sze Wei Chum

Sze Wei Chum has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electroless copper plating compositions
    Patent number: 10060034
    Abstract: Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: August 28, 2018
    Assignee: Rohm and Haas Electronic Materials LLC
    Inventors: Meng Qi, Sze Wei Chum, Ping Ling Li
  • ELECTROLESS COPPER PLATING COMPOSITIONS
    Publication number: 20180209048
    Abstract: Electroless copper plating compositions including (a) copper ions, (b) a complexing agent for copper ions, (c) a reducing agent, (d) a pH adjustor and (e) a stabilizer is disclosed. The stabilizer has a specific chemical structure, and contributes to stable an electroless copper plating composition from decomposition.
    Type: Application
    Filed: January 23, 2017
    Publication date: July 26, 2018
    Inventors: Meng Qi, Sze Wei Chum, Ping Ling Li