Patents by Inventor Szu-Cheng Huang

Szu-Cheng Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Eliminating residual polymer in the cleaning process of post pad etching
    Publication number: 20030196681
    Abstract: A method for eliminating residual polymers for cleaning etched windows of bonding pads. The invention provides a wafer with etched bonding pad windows that is free of residual polymer. Residual polymers induce an increase in the defect rate of cleaning process and bonding process. The wet stripping process peels Polyimide pieces from the surface of the passivation layer to form residual polymers on the wafer. The present invention utilizes the O2-ashing process to eliminate the residual polymers on the wafer. The present invention not only prevents Al—F formation on the bonding pads but also eliminates the residual polymers on the wafer. Therefore, the present invention may enhance the yield rate of semiconductor manufacturing by reducing the defect rates. The present invention does not increase the cost of the cleaning process but does increase the quality of the semiconductor.
    Type: Application
    Filed: April 23, 2002
    Publication date: October 23, 2003
    Inventors: Ching-Ping Wu, H. W. Lee, Szu-Cheng Huang, Nan-Tzu Lian, Hsin-Cheng Liu