Patents by Inventor Szu-Fan Chen

Szu-Fan Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11961779
    Abstract: A package includes a substrate having a conductive layer, and the conductive layer comprises an exposed portion. A die stack is disposed over the substrate and electrically connected to the conductive layer. A high thermal conductivity material is disposed over the substrate and contacting the exposed portion of the conductive layer. The package further includes a contour ring over and contacting the high thermal conductivity material.
    Type: Grant
    Filed: May 27, 2021
    Date of Patent: April 16, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC).
    Inventors: Wensen Hung, Szu-Po Huang, Hsiang-Fan Lee, Kim Hong Chen, Chi-Hsi Wu, Shin-Puu Jeng
  • Publication number: 20220249209
    Abstract: An oral scanner including a heating element, a reflecting element and a temperature difference generating element is provided. The temperature difference generating element has a high temperature end and a low temperature end. The high temperature end is connected to the reflecting element to heat the reflecting element, and the low temperature end is connected to the heating element to cool the heating element.
    Type: Application
    Filed: January 24, 2022
    Publication date: August 11, 2022
    Applicant: Qisda Corporation
    Inventors: Chien-Hung LIN, Po-Fu WU, Jun-Ming SHEN, Szu-Fan CHEN, Yi-Ling LO
  • Publication number: 20200249553
    Abstract: A projection apparatus includes a solid-state light source module, a high-voltage power source, an image-forming-light generating module, an insulation ring and a projection lens module. The solid-state light source module has a solid-state light source and a first metal casing. The solid-state light source is disposed in the first metal casing. The high-voltage power source is electrically connected to the solid-state light source for providing electrical power to drive the solid-state light source to emit light. The image-forming-light generating module has a second metal casing. The insulation ring is connected to the first metal casing and the second metal casing for insulating the first metal casing from the second metal casing. The projection lens module is connected to the image-forming-light generating module for projecting an image generated by light emitted from the solid-state light source after the light enters the image-forming-light generating module through the insulation ring.
    Type: Application
    Filed: January 9, 2020
    Publication date: August 6, 2020
    Inventors: Chi-Jen Chen, Chih-Hsiang Wu, Kuo-Chun Lee, Szu-Fan Chen