Abstract: A photosensitive resin composition comprises a modified polyimide polymer having a chemical structural formula of: photosensitive monomers, a bisphenol A epoxy resin, a photo-initiator, and a pigment. The modified polyimide polymer is made by a reaction of a polyimide polymer having a chemical structural formula of: and glycidyl methacrylate. The carboxyl group of the polyimide polymer reacts with the epoxy group of glycidyl methacrylate. The polyimide polymer is made by a reaction of dianhydride monomers each having an A group, diamine monomers each having the R group, diamine monomers each having the R1 group, and diamine monomers each having the R2 group. The diamine monomer having R group is a diamine compound having R group bonding with the carboxyl group. The diamine monomer having R1 group is a soft long-chain diamine monomer. R2 group comprises at least one secondary amine group or tertiary amine group.

Abstract: A low dielectric polyimide composition comprises an aliphatic anhydride, a long chain diamine, and an ester diamine. A polyimide made of such low dielectric polyimide composition has low polarizability group, thus the dielectric constant of the polyimide is lower. A polyimide made of the low dielectric polyimide composition, a polyimide film using the polyimide, and a copper clad laminate using the polyimide film are also provided.

Abstract: A low dielectric resin composition comprises a low dielectric resin containing acid anhydride, an epoxy resin, a rigid cross-linking agent, a soft cross-linking agent, and an accelerator. Such low dielectric resin can be dissolved in organic solvent more easily than a low dielectric resin without acid anhydride, and the low dielectric resin containing acid anhydride has a better compatibility with other organic components than a low dielectric resin without acid anhydride. A low dielectric resin composition with lower dielectric constant and better properties can thus be obtained. A film and a circuit board using such resin composition are also provided.

Abstract: A resin composition having lower dielectric constant Dk, lower dielectric loss Df, lower water absorption, higher surface impedance, and higher glass transition temperature includes resins. The resins have a chemical structure selected from a group consisting of or any combination thereof.

Abstract: A resin composition for a PCB includes a styrene-butadiene-styrene block copolymer in an amount from 95 to 100 parts by weight, a modified porous spheres of silicon oxide in an amount from 1 to 50 parts by weight, and a liquid polybutadiene in an amount from 5 to 50 parts by weight. The styrene-butadiene-styrene block copolymer and the liquid polybutadiene both include vinyl groups on the molecular side chains. The modified porous spheres of silicon oxide also include vinyl groups. An adhesive film and a circuit board using the resin composition are also provided.

Abstract: A polyamic acid as a polymer of a dianhydride monomer and a diamine monomer is disclosed. The dianhydride monomer is an aromatic tetrabasic carboxylic acid dianhydride monomer. The diamine monomer comprises a diamine monomer containing pyrimidinyl and an aromatic diamine monomer. A polyimide, a polyimide film and a copper clad laminate using the polyamic acid are also provided.

Abstract: A circuit board includes at least two substrates and an adhesive film sandwiched between the two substrates. Each substrate includes a base board. The base board includes conductive wires. Each base board is connected to the other base board by the adhesive film. The adhesive film includes two first adhesive layers and a second adhesive layer. The second adhesive layer is sandwiched between the two first adhesive layers. An adhesion force of the first adhesive layer is greater than an adhesion force of the second adhesive layer. A major composition of the second adhesive layer is rubber. The rubber is selected from a group consisting of isoprene rubber, styrene butadiene rubber, ethylene propylene rubber, butyl rubber, acrylic rubber, and polybutadiene rubber, and mixtures thereof.

Abstract: A polyimide shield includes a base film layer that is made from polyimide, and a colored film layer that overlies the base film layer and that contains a coloring agent dispersed in a polymer. A method of making the polyimide shield includes forming the base film layer from polyimide and applying a liquid composition onto the base film layer. The liquid composition contains a polymer and the coloring agent that is dispersed in the polymer. An integrated circuit structure includes a circuitry substrate and the polyimide shield that covers the circuitry substrate.